公开(公告)号：US20230134317A1

公开(公告)日：2023-05-04

申请号：US17958452

申请日：2022-10-03

Applicant: Innolux Corporation

Inventor： Hao-Jung Huang ,  Chia-Chun Liu

IPC: H01L23/538

Abstract: Disclosed are an electrical connection structure and an electronic device including the same. The electrical connection structure includes a first substrate, a first conductive pad, a second substrate, a second conductive pad, a through hole, and a conductive material is provided. The first conductive pad is disposed on the first substrate. The first conductive pad includes a first upper surface. The second conductive pad is disposed on the second substrate. The second conductive pad includes a second upper surface. The through hole penetrates the first substrate and exposes a part of the second upper surface. The conductive material is partially disposed in the through hole. The conductive material includes a narrowest portion and a first contact portion in contact with the second upper surface. A length of the first contact portion is greater than a length of the narrowest portion in a cross-sectional view.

公开(公告)号：US20220328459A1

公开(公告)日：2022-10-13

申请号：US17693452

申请日：2022-03-14

Applicant: Innolux Corporation

Inventor： Chang-Ching Wu ,  Chia-Chun Liu ,  Yun-Sheng Chen ,  Hao-Jung Huang ,  Ker-Yih Kao

IPC: H01L25/075 ,  H01L33/52

Abstract: An electronic device and a manufacturing method thereof are provided. The electronic device includes a substrate, multiple light emitting elements, and a light absorbing layer. The light emitting elements are disposed on the substrate. One of the light emitting elements has at least one lateral surface. The light absorbing layer is disposed on the substrate and is located between two adjacent light emitting elements, and the light absorbing layer contacts the at least one lateral surface.

公开(公告)号：US09947893B2

公开(公告)日：2018-04-17

申请号：US15200056

申请日：2016-07-01

Applicant: InnoLux Corporation

Inventor： Kuang-Pin Chao ,  Chia-Chun Liu ,  Chao-Hsiang Wang ,  Yi- Ching Chen

IPC: H01L29/08 ,  H01L51/52

CPC classification number: H01L51/5246 ,  H01L51/5237

Abstract: An organic light-emitting diode display is provided. The organic light-emitting diode display includes a first substrate, a second substrate, a frit, a metal layer, and an insulating layer. The second substrate is arranged to be separated from the first substrate. The frit is located between the first and second substrates. The metal layer is disposed on the first substrate, and the frit is located on the metal layer. The metal layer includes at least one opening. The frit is located in the opening. The frit has a number of voids arranged to correspond to the opening.