公开(公告)号：US11150189B1

公开(公告)日：2021-10-19

申请号：US16558809

申请日：2019-09-03

Applicant: InnoLux Corporation

Inventor： Wan-Ting Ke ,  Allen Tseng ,  Wen-Hsiang Liao ,  Yi-Chen Chou

IPC: G01N21/64 ,  G01N21/88 ,  G01R31/26

Abstract: A method of manufacturing a light source carrier with at least one light source, including: providing a substrate with a plurality of light source groups disposed thereon, wherein each light source group includes the at least one light source; irradiating a first light upon one of the light source groups through a first mask; capturing a photoluminescent light emitted by the one of the light source groups to acquire data; comparing the data with a reference to determine whether the one of the light source groups is qualified; providing a carrier; and transferring the one of the light source groups from the substrate to the carrier if the one of the light source groups is qualified.

公开(公告)号：US12131917B2

公开(公告)日：2024-10-29

申请号：US17523919

申请日：2021-11-11

Applicant: Innolux Corporation

Inventor： Yi-Hung Lin ,  Wen-Hsiang Liao ,  Cheng-Chi Wang ,  Yi-Chen Chou ,  Fuh-Tsang Wu ,  Ker-Yih Kao

IPC: H01L21/56 ,  H01L21/02 ,  H01L21/48 ,  H01L23/31

CPC classification number: H01L21/566 ,  H01L21/0214 ,  H01L21/02164 ,  H01L21/4857 ,  H01L23/3192 ,  H01L2224/82005

Abstract: A manufacturing method of a package structure including the following steps is provided. A carrier is provided. An anti-warpage structure is formed on the carrier. And a redistribution layer is formed on the carrier. In the normal direction of the carrier, a warpage trend of the anti-warpage structure is opposite to a warpage trend of the redistribution layer.

公开(公告)号：US20250014913A1

公开(公告)日：2025-01-09

申请号：US18893927

申请日：2024-09-23

Applicant: Innolux Corporation

Inventor： Yi-Hung Lin ,  Wen-Hsiang Liao ,  Cheng-Chi Wang ,  Yi-Chen Chou ,  Fuh-Tsang Wu ,  Ker-Yih Kao

IPC: H01L21/56 ,  H01L21/02 ,  H01L21/48 ,  H01L23/31

Abstract: An electronic device includes a wafer, a redistribution layer and a multi-layer insulating structure. The redistribution layer is disposed on the wafer. The multi-layer insulating structure is disposed between the wafer and the redistribution layer. The multi-layer insulating structure includes a first layer and a second layer. A Young's modulus of the first layer is different from a Young's modulus of the second layer.

公开(公告)号：US20220181167A1

公开(公告)日：2022-06-09

申请号：US17523919

申请日：2021-11-11

Applicant: Innolux Corporation

Inventor： Yi-Hung Lin ,  Wen-Hsiang Liao ,  Cheng-Chi Wang ,  Yi-Chen Chou ,  Fuh-Tsang Wu ,  Ker-Yih Kao

IPC: H01L21/56 ,  H01L21/02 ,  H01L21/48

Abstract: A manufacturing method of a package structure including the following steps is provided. A carrier is provided. An anti-warpage structure is formed on the carrier. And a redistribution layer is formed on the carrier. In the normal direction of the carrier, a warpage trend of the anti-warpage structure is opposite to a warpage trend of the redistribution layer.