公开(公告)号：US20220326096A1

公开(公告)日：2022-10-13

申请号：US17850561

申请日：2022-06-27

申请人： Intel Corporation

发明人： Smit Kapila ,  Abhishek Srivastav ,  Sumod Cherukkate ,  Manit Biswas ,  Zhongsheng Wang ,  Bijendra Singh ,  Deepak Ganapathy ,  Dipen Dudhat

IPC分类号： G01K11/22 ,  H05K7/20

摘要： Methods, apparatus, systems, and articles of manufacture are disclosed to monitor thermal degradation of a compute device. One such method includes calculating, by executing instructions with processor circuitry, a thermal degradation value based on an equation, the equation generated based on testing of thermal interface materials having varying degrees of degradation. The method also includes comparing, by executing instructions with the processor circuitry, the thermal degradation value to a thermal degradation threshold to determine whether the thermal degradation threshold is satisfied, and, when the thermal degradation threshold is satisfied, triggering generation of a thermal degradation alert.

公开(公告)号：US20240312736A1

公开(公告)日：2024-09-19

申请号：US18185460

申请日：2023-03-17

申请人： Intel Corporation

发明人： Abhishek Srivastav ,  Smit Kapila ,  Prakash Kurma Raju ,  Sumod Cherukkate ,  Vijith Halestoph R ,  Srikanth Potluri

IPC分类号： H01H13/14 ,  G06F3/02 ,  H01H13/70 ,  H04R1/02 ,  H04R7/04

CPC分类号： H01H13/14 ,  G06F3/0202 ,  H01H13/70 ,  H04R1/028 ,  H04R7/04 ,  H01H2239/048 ,  H04R2499/15

摘要： Keyboards for electronic devices with keys having integrated speakers are disclosed herein. An example keyboard includes a key having a key cap and a speaker coupled to the key cap. The speaker is disposed in or at least partially covered by the key cap.