公开(公告)号：US20220326096A1

公开(公告)日：2022-10-13

申请号：US17850561

申请日：2022-06-27

Applicant: Intel Corporation

Inventor： Smit Kapila ,  Abhishek Srivastav ,  Sumod Cherukkate ,  Manit Biswas ,  Zhongsheng Wang ,  Bijendra Singh ,  Deepak Ganapathy ,  Dipen Dudhat

IPC: G01K11/22 ,  H05K7/20

Abstract: Methods, apparatus, systems, and articles of manufacture are disclosed to monitor thermal degradation of a compute device. One such method includes calculating, by executing instructions with processor circuitry, a thermal degradation value based on an equation, the equation generated based on testing of thermal interface materials having varying degrees of degradation. The method also includes comparing, by executing instructions with the processor circuitry, the thermal degradation value to a thermal degradation threshold to determine whether the thermal degradation threshold is satisfied, and, when the thermal degradation threshold is satisfied, triggering generation of a thermal degradation alert.