公开(公告)号：US11916003B2

公开(公告)日：2024-02-27

申请号：US16575307

申请日：2019-09-18

申请人： Intel Corporation

发明人： Xiao Lu ,  Jiongxin Lu ,  Christopher Combs ,  Alexander Huettis ,  John Harper ,  Jieping Zhang ,  Nachiket R. Raravikar ,  Pramod Malatkar ,  Steven A. Klein ,  Carl Deppisch ,  Mohit Sood

IPC分类号： H01L23/48 ,  B23K3/06 ,  H01L23/498 ,  H01L23/538

CPC分类号： H01L23/49833 ,  B23K3/0623 ,  H01L23/49822 ,  H01L23/4985 ,  H01L23/5387

摘要： Embodiments disclosed herein include electronic packages. In an embodiment, the electronic package comprises a first substrate; a second substrate; and an array of interconnects electrically coupling the first substrate to the second substrate. In an embodiment, the array of interconnects comprises first interconnects, wherein the first interconnects have a first volume and a first material composition, and second interconnects, wherein the second interconnects have a second volume and a second material composition, and wherein the first volume is different than the second volume and/or the first material composition is different than the second material composition.