公开(公告)号：US09508610B2

公开(公告)日：2016-11-29

申请号：US14499120

申请日：2014-09-27

申请人： INTEL CORPORATION

发明人： Shuhong Liu ,  Nilanjan Z. Ghosh ,  Zhiyong Wang ,  Deepak Goyal ,  Shripad Gokhale ,  Jieping Zhang

IPC分类号： H01L21/66 ,  G01B11/06 ,  H01L23/31 ,  H01L23/00

CPC分类号： H01L22/12 ,  G01B11/06 ,  H01L23/3128 ,  H01L24/16 ,  H01L24/97 ,  H01L2224/16227 ,  H01L2224/97 ,  H01L2924/15331 ,  H01L2924/1815 ,  H01L2924/37001 ,  H01L2224/81

摘要： A method including emitting a terahertz beam from a light source at a layer of molding material; detecting a reflectance of the beam; and determining a thickness of the layer of molding material. A system including a panel supporter operable to support a panel including a plurality of substrates arranged in a planar array; a light source operable to emit a terahertz beam at a panel on the panel supporter; a detector operable to detect a reflection of a terahertz beam emitted at a panel; and a processor operable to determine a thickness of a material on the panel based on a time delay for an emitted terahertz beam to be detected by the detector.

摘要翻译： 一种包括在成型材料层从光源发射太赫兹光束的方法; 检测光束的反射率; 并确定成型材料层的厚度。 一种包括面板支撑件的系统，其可操作以支撑包括布置在平面阵列中的多个基板的面板; 光源，其可操作以在所述面板支撑件上的面板处发射太赫兹光束; 检测器，用于检测在面板上发射的太赫兹波束的反射; 以及处理器，其可操作以基于由检测器检测的发射的太赫兹光束的时间延迟来确定面板上的材料的厚度。

公开(公告)号：US20240096809A1

公开(公告)日：2024-03-21

申请号：US17932624

申请日：2022-09-15

申请人： Intel Corporation

发明人： Hiroki Tanaka ,  Robert Alan May ,  Onur Ozkan ,  Ali Lehaf ,  Steve Cho ,  Gang Duan ,  Jieping Zhang ,  Rahul N. Manepalli ,  Ravindranath Vithal Mahajan ,  Hamid Azimi

IPC分类号： H01L23/538 ,  H01L21/48 ,  H01L23/00 ,  H01L23/31 ,  H01L25/00 ,  H01L25/065

CPC分类号： H01L23/5386 ,  H01L21/4857 ,  H01L23/3121 ,  H01L23/5383 ,  H01L24/13 ,  H01L24/14 ,  H01L24/16 ,  H01L24/19 ,  H01L24/20 ,  H01L25/0652 ,  H01L25/0655 ,  H01L25/50 ,  H01L24/32 ,  H01L2224/13082 ,  H01L2224/1403 ,  H01L2224/16238 ,  H01L2224/19 ,  H01L2224/211 ,  H01L2224/2201 ,  H01L2224/32225

摘要： Microelectronic assemblies, related devices and methods, are disclosed herein. In some embodiments, a microelectronic assembly may include a substrate having a surface including first conductive contacts and second conductive contacts, wherein the first conductive contacts have a first thickness and the second conductive contacts have a second thickness different than the first thickness; a first microelectronic component having third conductive contacts, wherein respective ones of the third conductive contacts are coupled to respective ones of the first conductive contacts by first interconnects, wherein the first interconnects include solder having a thickness between 2 microns and 35 microns; and a second microelectronic component having fourth conductive contact, wherein respective ones of the fourth conductive contacts are coupled to respective ones of the second conductive contacts by second interconnects, wherein the second interconnects include solder having a thickness between 5 microns and 50 microns.

公开(公告)号：US11916003B2

公开(公告)日：2024-02-27

申请号：US16575307

申请日：2019-09-18

申请人： Intel Corporation

发明人： Xiao Lu ,  Jiongxin Lu ,  Christopher Combs ,  Alexander Huettis ,  John Harper ,  Jieping Zhang ,  Nachiket R. Raravikar ,  Pramod Malatkar ,  Steven A. Klein ,  Carl Deppisch ,  Mohit Sood

IPC分类号： H01L23/48 ,  B23K3/06 ,  H01L23/498 ,  H01L23/538

CPC分类号： H01L23/49833 ,  B23K3/0623 ,  H01L23/49822 ,  H01L23/4985 ,  H01L23/5387

摘要： Embodiments disclosed herein include electronic packages. In an embodiment, the electronic package comprises a first substrate; a second substrate; and an array of interconnects electrically coupling the first substrate to the second substrate. In an embodiment, the array of interconnects comprises first interconnects, wherein the first interconnects have a first volume and a first material composition, and second interconnects, wherein the second interconnects have a second volume and a second material composition, and wherein the first volume is different than the second volume and/or the first material composition is different than the second material composition.