公开(公告)号：US20250112160A1

公开(公告)日：2025-04-03

申请号：US18374611

申请日：2023-09-28

Applicant: Intel Corporation

Inventor： Andrew P. COLLINS ,  Jian Yong XIE ,  Aruna KUMAR ,  Rinkle JAIN ,  Basavaraj KANTHI

IPC: H01L23/538 ,  H01L23/00 ,  H01L23/498 ,  H01L25/065 ,  H10B80/00

Abstract: Embodiments disclosed herein include an apparatus for bump translation. In an embodiment, the apparatus includes a substrate with a first bump field with a first height and a first depth on the substrate, where the first depth is orthogonal to the first height, and where the first bump field further comprises a first pitch in a direction of the first height. In an embodiment, the apparatus includes a second bump field with a second height and a second depth on the substrate, where the second depth is orthogonal to the second height, and where the second bump field comprises a second pitch in a direction of the second height, where the second pitch is smaller than the first pitch. Embodiments include a third bump field with a third height and the second depth, where a sum of the second height and the third height is equal to the first height.

公开(公告)号：US20200328915A1

公开(公告)日：2020-10-15

申请号：US16305116

申请日：2017-06-06

Applicant: Intel Corporation

Inventor： Aruna KUMAR ,  Anoop KARUNAN ,  Ganesh BALAMURUGAN ,  Prakash RADHAKRISHNAN

IPC: H04L25/02 ,  H04L25/03 ,  H04L25/08 ,  H04L1/24 ,  H04L7/10

Abstract: Disclosed herein are devices and methods to facilitate compensating for intra-pair skew in a high-definition multimedia interface (HDMI) system. One or more skew training pattern may be transmitted on a signal line including a differential pair. Acknowledgment of receiving the skew training pattern may be received on a display data channel (DDC) associated with HDMI system. The skew training pattern may be used to ascertain and compensate for intra-pair skew.