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公开(公告)号:US20250112160A1
公开(公告)日:2025-04-03
申请号:US18374611
申请日:2023-09-28
Applicant: Intel Corporation
Inventor: Andrew P. COLLINS , Jian Yong XIE , Aruna KUMAR , Rinkle JAIN , Basavaraj KANTHI
IPC: H01L23/538 , H01L23/00 , H01L23/498 , H01L25/065 , H10B80/00
Abstract: Embodiments disclosed herein include an apparatus for bump translation. In an embodiment, the apparatus includes a substrate with a first bump field with a first height and a first depth on the substrate, where the first depth is orthogonal to the first height, and where the first bump field further comprises a first pitch in a direction of the first height. In an embodiment, the apparatus includes a second bump field with a second height and a second depth on the substrate, where the second depth is orthogonal to the second height, and where the second bump field comprises a second pitch in a direction of the second height, where the second pitch is smaller than the first pitch. Embodiments include a third bump field with a third height and the second depth, where a sum of the second height and the third height is equal to the first height.
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公开(公告)号:US20200328915A1
公开(公告)日:2020-10-15
申请号:US16305116
申请日:2017-06-06
Applicant: Intel Corporation
Inventor: Aruna KUMAR , Anoop KARUNAN , Ganesh BALAMURUGAN , Prakash RADHAKRISHNAN
Abstract: Disclosed herein are devices and methods to facilitate compensating for intra-pair skew in a high-definition multimedia interface (HDMI) system. One or more skew training pattern may be transmitted on a signal line including a differential pair. Acknowledgment of receiving the skew training pattern may be received on a display data channel (DDC) associated with HDMI system. The skew training pattern may be used to ascertain and compensate for intra-pair skew.
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