公开(公告)号：US20240395661A1

公开(公告)日：2024-11-28

申请号：US18202046

申请日：2023-05-25

Applicant: Intel Corporation

Inventor： Numair Ahmed ,  Suddhasattwa Nad ,  Mohammad Mamunur Rahman ,  Brandon C. Marin ,  Sashi S. Kandanur ,  Srinivas Venkata Ramanuja Pietambaram ,  Darko Grujicic ,  Gang Duan ,  Banjamin Duong

IPC: H01L23/473 ,  H01L23/31 ,  H01L23/373 ,  H01L23/48 ,  H01L23/498

Abstract: An electronic device and associated methods are disclosed. In one example, the electronic device includes a glass core layer having a first surface layer and a second surface layer; multiple channels within the glass core layer between the first surface and the second surface layer; and a first redistribution layer (RDL) including multiple sublayers of conductive traces formed in an organic material, wherein a first surface of the RDL contacts the first surface of the glass core layer.