公开(公告)号：US20250128362A1

公开(公告)日：2025-04-24

申请号：US18492371

申请日：2023-10-23

Applicant: Intel Corporation

Inventor： Rui Zhang ,  Jiaqi Wu ,  Brian Franco ,  Xiao Lu ,  Mukul Renavikar

IPC: B23K35/26 ,  B23K35/02 ,  B23K103/08 ,  C22C13/02

Abstract: Solder materials and microelectronic devices and systems deploying the solder materials are discussed. The solder material includes a bulk material of tin and bismuth and particles interspersed in the tin and bismuth bulk material. The particles are a metal other than tin and bismuth, and an intermetallic compound is formed around the particles. The intermetallic compound includes the metal of the particles and tin or bismuth. The solder materials are deployed as interconnect structures to interconnect components, such as electrically coupling an integrated circuit package to a motherboard.

公开(公告)号：US20250112198A1

公开(公告)日：2025-04-03

申请号：US18375248

申请日：2023-09-29

Applicant: Intel Corporation

Inventor： Pratyasha Mohapatra ,  Kyle Davidson ,  Brian Franco

IPC: H01L23/00

Abstract: An apparatus is provided which comprises: a device surface, wherein the device surface comprises an array of solder contacts, a substrate surface, wherein the substrate surface comprises an array of pads, the array of solder contacts coupled with the array of pads, and a formation of epoxy coupled with the device surface and the substrate surface, wherein the formation of epoxy is entirely within an area of the array of solder contacts. Other embodiments are also disclosed and claimed.