公开(公告)号：US20240222304A1

公开(公告)日：2024-07-04

申请号：US18148148

申请日：2022-12-29

申请人： Intel Corporation

发明人： Bohan Shan ,  Jiaqi Wu ,  Haobo Chen ,  Srinivas Pietambaram ,  Bai Nie ,  Gang Duan ,  Kyle Arrington ,  Ziyin Lin ,  Hongxia Feng ,  Yiqun Bai ,  Xiaoying Guo ,  Dingying Xu

IPC分类号： H01L23/00 ,  H01L23/538

CPC分类号： H01L24/16 ,  H01L23/538 ,  H01L24/03 ,  H01L24/05 ,  H01L24/08 ,  H01L24/09 ,  H01L24/11 ,  H01L24/13 ,  H01L24/17 ,  H01L24/81 ,  H01L25/16

摘要： Methods and apparatus to reduce solder bump bridging between two substrates. An apparatus includes a first substrate including a first bump and a second bump spaced apart from the first bump, the first bump including a first base, the second bump including a second base; and a second substrate including a third bump and a fourth bump spaced apart from the third bump, the third bump including a third base, the fourth bump including a fourth base, the first base electrically coupled to the third base by first solder, the second base electrically coupled to the fourth base by second solder, the first solder having a first volume, the second solder having a second volume, the first volume less than the second volume.

公开(公告)号：US20230317476A1

公开(公告)日：2023-10-05

申请号：US17712090

申请日：2022-04-02

申请人： Intel Corporation

发明人： Sangeon Lee ,  Tingting Gao ,  Xiao Lu ,  Jiaqi Wu ,  Matthew T. Magnavita ,  Andrew W. Carlson

IPC分类号： H01L21/67 ,  H01L23/498 ,  H01L21/48

CPC分类号： H01L21/6715 ,  H01L23/49811 ,  H01L21/4853 ,  H01L21/4867

摘要： In one embodiment, a direct injection device includes a head, a plunger, a reservoir, and multiple needles. The head controls extrusion of liquid stored in the reservoir of the direct injection device. For example, the head causes the plunger to compress the liquid in the reservoir, which causes the liquid to be extruded through the needles.

公开(公告)号：US20230299024A1

公开(公告)日：2023-09-21

申请号：US17696162

申请日：2022-03-16

申请人： Intel Corporation

发明人： Jiaqi Wu ,  Xiao Lu ,  Bohan Shan ,  Valery Ouvarov-Bancalero

IPC分类号： H01L23/00 ,  B23K1/00 ,  B23K35/26

CPC分类号： H01L24/05 ,  B23K1/0008 ,  H01L24/14 ,  B23K35/26 ,  B23K2101/40

摘要： In one embodiment, an integrated circuit apparatus comprises a substrate that includes electrical contacts on a first side of the substrate to couple the substrate to an integrated circuit die, a passivation layer on a second side of the substrate opposite the first side, metal pads on the second side of the substrate and within openings defined by the passivation layer, and solder bumps on the metal pads. The solder bumps are a material that is resistant to Gallium-based liquid metal embrittlement.

公开(公告)号：US20230415253A1

公开(公告)日：2023-12-28

申请号：US17851968

申请日：2022-06-28

申请人： Intel Corporation

发明人： Sangeon Lee ,  Tingting Gao ,  Xiao Lu ,  Matthew T. Magnavita ,  Jiaqi Wu

IPC分类号： B23K3/06

CPC分类号： B23K3/0638 ,  B23K2101/40

摘要： A liquid metal (LM) dispensing apparatus and method for design and fabrication thereof. Components of the LM dispensing apparatus are designed and tooled based on a target pinout (e.g., a number of, arrangement of, and dimensions of, holes in a substrate to have LM injected therein) and desired LM material. Embodiments employ detachably attached needles using a locking means to provide leak-free interchangeability of the needles. The flexibility with needles makes replacing damaged needles more perfunctory. Embodiments contour the LM reservoir to enhance uniform LM flow to the needles and dispense or inject LM from multiple detachably attached needles concurrently.