公开(公告)号：US20240413054A1

公开(公告)日：2024-12-12

申请号：US18810136

申请日：2024-08-20

Applicant: Intel Corporation

Inventor： Min Pei ,  Ralph V. Miele ,  Lejie Liu ,  Phil Geng ,  Caleb Million Tessema

IPC: H01L23/467 ,  H01L23/367 ,  H01L23/40

Abstract: Integrated circuit packages with fluid spacers to improve pin load distribution are disclosed. An example apparatus includes an integrated circuit (IC) package, a circuit board, a socket to couple the IC package and the circuit board, a backplate coupled to the circuit board, a loading assembly to provide a stack load to the IC package, and a fluid liner positioned between the circuit board and the backplate.