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公开(公告)号:US20240413054A1
公开(公告)日:2024-12-12
申请号:US18810136
申请日:2024-08-20
Applicant: Intel Corporation
Inventor: Min Pei , Ralph V. Miele , Lejie Liu , Phil Geng , Caleb Million Tessema
IPC: H01L23/467 , H01L23/367 , H01L23/40
Abstract: Integrated circuit packages with fluid spacers to improve pin load distribution are disclosed. An example apparatus includes an integrated circuit (IC) package, a circuit board, a socket to couple the IC package and the circuit board, a backplate coupled to the circuit board, a loading assembly to provide a stack load to the IC package, and a fluid liner positioned between the circuit board and the backplate.