公开(公告)号：US20250055217A1

公开(公告)日：2025-02-13

申请号：US18929426

申请日：2024-10-28

Applicant: Intel Corporation

Inventor： Min Pei ,  Lejie Liu ,  Ralph Miele ,  Phil Geng ,  Steven Klein

IPC: H01R13/24 ,  H01R12/71

Abstract: A Land Grid Array (LGA) interface assembly used to physically interface or connect a semiconductor package (e.g., a semiconductor, a microprocessor, etc.) and a PCB, motherboard, etc. The LGA interface assembly including an LGA socket including a plurality of socket pins arranged and configured to contact a plurality of contact pads on the semiconductor package to enable data transfer. The socket pins including a multi-bend and/or zig-zag configuration arranged and configured to minimize lateral displacement of the socket pin relative to the contact pad during insertion of the semiconductor package into the LGA socket. Other embodiments are described and claimed.

公开(公告)号：US20250089192A1

公开(公告)日：2025-03-13

申请号：US18961017

申请日：2024-11-26

Applicant: Intel Corporation

Inventor： Phil Geng ,  Dongwang Chen ,  Fernando Gonzalez Lenero ,  Chuansheng Liu ,  Lejie Liu ,  Ralph V. Miele ,  Mohanraj Prabhugoud ,  Sanjoy Saha ,  David Shia ,  Jeffory L. Smalley ,  Ke Song ,  Meng Wang ,  Xiaoning Ye ,  Juan Zermeno Carriedo ,  Yipeng Zhong

IPC: H05K5/02 ,  H05K5/04

Abstract: Composite backplate architectures for backside power delivery and associated methods are disclosed. An example backplate includes a first layer including a first material, and a second layer attached to the first layer. The second layer includes a second material different from the first material. The example backplate further includes a bus bar attached to the first layer.

公开(公告)号：US20240413054A1

公开(公告)日：2024-12-12

申请号：US18810136

申请日：2024-08-20

Applicant: Intel Corporation

Inventor： Min Pei ,  Ralph V. Miele ,  Lejie Liu ,  Phil Geng ,  Caleb Million Tessema

IPC: H01L23/467 ,  H01L23/367 ,  H01L23/40

Abstract: Integrated circuit packages with fluid spacers to improve pin load distribution are disclosed. An example apparatus includes an integrated circuit (IC) package, a circuit board, a socket to couple the IC package and the circuit board, a backplate coupled to the circuit board, a loading assembly to provide a stack load to the IC package, and a fluid liner positioned between the circuit board and the backplate.