公开(公告)号：US20240339412A1

公开(公告)日：2024-10-10

申请号：US18130584

申请日：2023-04-04

Applicant: Intel Corporation

Inventor： Cary KULIASHA ,  Brandon C. MARIN ,  Kristof DARMAWIKARTA ,  Srinivas V. PIETAMBARAM

IPC: H01L23/538 ,  H01L23/64 ,  H01L25/065

CPC classification number: H01L23/5386 ,  H01L23/5384 ,  H01L23/645 ,  H01L25/0655 ,  H01L24/16 ,  H01L2224/16235 ,  H01L2924/1511

Abstract: Embodiments disclosed herein include an interconnect bridge. In an embodiment, the interconnect bridge comprises a substrate, and a first trace on the substrate. In an embodiment, a first layer is on the first trace, where the first layer comprises a magnetic material. In an embodiment, a second layer is over the substrate, where the second layer comprises an insulating material. In an embodiment, a second trace is embedded in the second layer.