公开(公告)号：US20220100692A1

公开(公告)日：2022-03-31

申请号：US17033593

申请日：2020-09-25

Applicant: Intel Corporation

Inventor： Dheeraj SUBBAREDDY ,  Ankireddy NALAMALPU ,  Anshuman THAKUR ,  MD Altaf HOSSAIN ,  Mahesh KUMASHIKAR ,  Kemal AYGÜN ,  Casey THIELEN ,  Daniel KLOWDEN ,  Sandeep B. SANE

IPC: G06F13/42

Abstract: Embodiments herein relate to systems, apparatuses, or processes for improving off-package edge bandwidth by overlapping electrical and optical serialization/deserialization (SERDES) interfaces on an edge of the package. In other implementations, off-package bandwidth for a particular edge of a package may use both an optical fanout and an electrical fanout on the same edge of the package. In embodiments, the optical fanout may use a top surface or side edge of a die and the electrical fanout may use the bottom side edge of the die. Other embodiments may be described and/or claimed.