公开(公告)号：US20240413031A1

公开(公告)日：2024-12-12

申请号：US18207808

申请日：2023-06-09

Applicant: Intel Corporation

Inventor： Chandru Periasamy ,  Jagat Shakya ,  Joshua Jeremy Cardiel Rivera ,  Jaime A. Sanchez ,  Devesh Srivastava ,  Feras Eid ,  Matthew Zeman ,  Xavier F. Brun ,  Nabankur Deb

IPC: H01L23/31 ,  H01L21/56 ,  H01L23/367 ,  H01L23/373

Abstract: An electronic device and associated methods are disclosed. Electronic devices are shown that include a semiconductor die and a patterned layer connected to a backside of the die. Electronic devices are shown that include a pattern of elements across a patterned layer that varies across the backside of a die. Electronic devices are further shown that include a compliant filler within elements in a patterned layer.

公开(公告)号：US10080011B1

公开(公告)日：2018-09-18

申请号：US15491343

申请日：2017-04-19

Applicant: Intel Corporation

Inventor： Chandru Periasamy

IPC: G02B6/06 ,  H04N13/204 ,  H04N13/02 ,  G02B6/08 ,  G02B3/00 ,  G02B6/28 ,  G06T7/00 ,  G06T7/62

CPC classification number: H04N13/204 ,  G02B3/0056 ,  G02B6/08 ,  G02B6/2848 ,  G02B6/2856 ,  G02B27/0075 ,  H04N5/2253 ,  H04N5/22541

Abstract: Embodiments of the present disclosure provide for a light field imaging apparatus and method. In one embodiment, an apparatus may comprise one or more imaging modules that may include a lens array, to receive a light field of a surface of an object or scene, and a fiber optic image transferring device having a first end and a second end. The fiber optic image transferring device may be coupled with the lens array at the first end, to transfer the light field to the second end. The apparatus may further include an image sensor coupled with the second end of the fiber optic image transferring device, to register the transferred light field and provide the registered light field for processing. Other embodiments may be described and/or claimed.