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公开(公告)号：US20220196728A1
公开(公告)日：2022-06-23
申请号：US17689703
申请日：2022-03-08
Applicant: Intel Corporation
Inventor： Alexander I. Mamchik , Jaime A. Sanchez , Sachin Gupta , Matthew C. Zeman
IPC: G01R31/28
Abstract: Disclosed herein is a high-performance thermal chuck for enhanced thermal management of high-power integrated circuit (IC) devices. The disclosed high-performance thermal chuck provides active heating and cooling for post-manufacture device testing. A high-performance heatsink comprises microfluidic channels in a high thermal conductivity silicon carbide (SiC) body for providing enhanced active cooling of an IC device. A refractory heating element is embedded between an integrated heat spreader comprising diamond and the heatsink for providing active heating. The integrated heat spreader is bonded to the heatsink. Closely matched coefficients of thermal expansion between the diamond heat spreader and the heatsink mitigate thermally-induced warpage.
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公开(公告)号：US11184997B2
公开(公告)日：2021-11-23
申请号：US15960127
申请日：2018-04-23
Applicant: Intel Corporation
Inventor： Joseph Andrew Broderick , Barrett M. Faneuf , Eric D. McAfee , Juan G. Cevallos , Jaime A. Sanchez , Emery E. Frey
Abstract: Embodiments described herein may include apparatuses, systems and/or processes to encapsulate a circuit board to be cooled with a liquid coolant, that includes a first part dimensioned to receive the circuit board coupled with one or more heat sinks; a second part dimensioned to mate with the first part, and with a portion of a side of the circuit board around the one or more heat sinks to create a volume surrounding the circuit board, with a portion of the one or more heat sinks are outside the volume and is to be exposed to the liquid coolant, and a sealer to seal areas where the second part mates with the first part and the portion of the side of the circuit board, to prevent the liquid coolant from entering the volume. Other embodiments may be described and/or claimed.
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公开(公告)号：US20240413031A1
公开(公告)日：2024-12-12
申请号：US18207808
申请日：2023-06-09
Applicant: Intel Corporation
Inventor： Chandru Periasamy , Jagat Shakya , Joshua Jeremy Cardiel Rivera , Jaime A. Sanchez , Devesh Srivastava , Feras Eid , Matthew Zeman , Xavier F. Brun , Nabankur Deb
IPC: H01L23/31 , H01L21/56 , H01L23/367 , H01L23/373
Abstract: An electronic device and associated methods are disclosed. Electronic devices are shown that include a semiconductor die and a patterned layer connected to a backside of the die. Electronic devices are shown that include a pattern of elements across a patterned layer that varies across the backside of a die. Electronic devices are further shown that include a compliant filler within elements in a patterned layer.
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公开(公告)号：US20190045661A1
公开(公告)日：2019-02-07
申请号：US15960127
申请日：2018-04-23
Applicant: Intel Corporation
Inventor： Joseph Andrew Broderick , Barrett M. Faneuf , Eric D. McAfee , Juan G. Cevallos , Jaime A. Sanchez , Emery E. Frey
Abstract: Embodiments described herein may include apparatuses, systems and/or processes to encapsulate a circuit board to be cooled with a liquid coolant, that includes a first part dimensioned to receive the circuit board coupled with one or more heat sinks; a second part dimensioned to mate with the first part, and with a portion of a side of the circuit board around the one or more heat sinks to create a volume surrounding the circuit board, with a portion of the one or more heat sinks are outside the volume and is to be exposed to the liquid coolant, and a sealer to seal areas where the second part mates with the first part and the portion of the side of the circuit board, to prevent the liquid coolant from entering the volume. Other embodiments may be described and/or claimed.
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