利索-全球专利检索

  1. 登录
  2. 注册

搜索结果

563 条记录 (耗时 0.03 秒)

    Optical splicing structure, manufacturing method thereof and splicing display device
    1.
    发明授权
    Optical splicing structure, manufacturing method thereof and splicing display device 有权

    公开(公告)号：US12055754B2

    公开(公告)日：2024-08-06

    申请号：US17971877

    申请日：2022-10-24

    申请人： HKC CORPORATION LIMITED

    发明人： Ye Wan ,  Baohong Kang

    IPC分类号： G02B6/08 ,  G02B6/255

    CPC分类号： G02B6/08 ,  G02B6/2555 ,  G02B6/2558

    摘要： Disclosed are an optical splicing structure, a method for manufacturing the optical splicing structure and a splicing display device. The optical splicing structure is provided at the splice position of two display panels, the optical splicing structure includes a plastic sealing body and an optical fiber bundle, the plastic sealing body includes an incident end and a light emitting end opposite to the incident end; the optical fiber bundle includes a plurality of optical fiber lines distributed in the plastic sealing body; a plurality of the optical fiber lines extend in the direction of the incident end to the light emitting end and are arranged in a direction perpendicular to the direction from the incident end to the light emitting end.

    OPTICAL FIBER BOARD STRUCTURE AND MANUFACTURING METHOD THEREOF, OPTICAL FIBER INTERCONNECTION BOARD, AND FIBER DISPOSING DEVICE
    3.
    发明公开
    OPTICAL FIBER BOARD STRUCTURE AND MANUFACTURING METHOD THEREOF, OPTICAL FIBER INTERCONNECTION BOARD, AND FIBER DISPOSING DEVICE 审中-公开

    公开(公告)号：US20240142709A1

    公开(公告)日：2024-05-02

    申请号：US18406249

    申请日：2024-01-08

    申请人： HUAWEI TECHNOLOGIES CO., LTD.

    发明人： Tianhai CHEN ,  Huizhong FAN

    IPC分类号： G02B6/36 ,  G02B6/08

    CPC分类号： G02B6/3608 ,  G02B6/08 ,  G02B6/3672

    摘要： The technology of this application relates to an optical fiber board structure moused for an optical fiber connection between optical communication boards, or used for an optical fiber connection between an optical chip on an optical communication board and an optical connector. The optical fiber board structure includes: M optical fiber layers. The M optical fiber layers are stacked along a thickness direction of the optical fiber layers. Each optical fiber layer includes a plurality of optical fibers. The plurality of optical fibers are arranged side by side, or at least some optical fibers are arranged in a cross manner. M can be a positive integer greater than or equal to 2. The optical fiber board structure and the optical fiber interconnection board provided in this application have relatively high optical fiber layout density.

    Methods for forming image transport layers
    9.
    发明授权
    Methods for forming image transport layers 有权

    公开(公告)号：US11619779B1

    公开(公告)日：2023-04-04

    申请号：US16536733

    申请日：2019-08-09

    申请人： Apple Inc.

    发明人： Jean-Pierre S. Guillou ,  Tyler R. Kakuda ,  Ying-Chih Wang ,  Michael J. Brown ,  Yi Qiao ,  Hao Dong ,  Paul C. Kelley ,  Shaorui Yang ,  Salman Karbasivalashani

    IPC分类号： G02B6/08 ,  H01L51/52

    摘要： An electronic device may have a display with pixels configured to display an image. An image transport layer may be formed from a coherent fiber bundle or Anderson localization material. The image transport layer may overlap the pixels and may have an input surface that receives the image from the pixels and a corresponding output surface on which the received image is viewable. The image transport layer may form an exterior surface of the electronic device or may be overlapped by a transparent cover layer. Various methods such as swelling, piping, and slumping may be used to process fibers and form image transport layers. A fiber bundle that is used to form an image transport layer may include fibers that have varying properties.