公开(公告)号：US20190037689A1

公开(公告)日：2019-01-31

申请号：US15849043

申请日：2017-12-20

Applicant: Intel Corporation

Inventor： DAQIAO DU ,  ZHEN ZHOU ,  JUN LIAO ,  JAMES A. MCCALL ,  XIANG LI ,  KAI XIAO ,  ZHICHAO ZHANG

IPC: H05K1/02 ,  H05K1/05 ,  H05K1/11 ,  H01R12/72

Abstract: A system for a three-dimensional (“3D”) printed circuit board (“PCB”) to printed circuit board interface is provided. A first PCB includes first landing pads disposed on one or more edges of the first PCB. The first landing pads electrically couple to conductive pins or second landing pads disposed on a second PCB. The second landing pads may be disposed in a slot in the second PCB. The interface between the first landing pads and the second landing pads may provide various advantages over traditional PCB to PCB interfaces, such as, improved signal integrity, improved power integrity, increased contact density, decreased clock jitter, etc.