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1.
公开(公告)号:US20190037689A1
公开(公告)日:2019-01-31
申请号:US15849043
申请日:2017-12-20
Applicant: Intel Corporation
Inventor: DAQIAO DU , ZHEN ZHOU , JUN LIAO , JAMES A. MCCALL , XIANG LI , KAI XIAO , ZHICHAO ZHANG
Abstract: A system for a three-dimensional (“3D”) printed circuit board (“PCB”) to printed circuit board interface is provided. A first PCB includes first landing pads disposed on one or more edges of the first PCB. The first landing pads electrically couple to conductive pins or second landing pads disposed on a second PCB. The second landing pads may be disposed in a slot in the second PCB. The interface between the first landing pads and the second landing pads may provide various advantages over traditional PCB to PCB interfaces, such as, improved signal integrity, improved power integrity, increased contact density, decreased clock jitter, etc.
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公开(公告)号:US20190044289A1
公开(公告)日:2019-02-07
申请号:US15900450
申请日:2018-02-20
Applicant: Intel Corporation
Inventor: XIANG LI , JAEJIN LEE , JUN LIAO , HAO-HAN HSU , GEORGE VERGIS , YUN LING , DONG-HO HAN , YUNHUI CHU
IPC: H01R13/6594 , H01R12/73 , H01R43/20
Abstract: A shielded SODIMM system for reducing RF emissions of a SODIMM connector is disclosed herein. SODIMM connector RFI presently interferes with connectivity and is also an obstacle for higher speed memory applications. The shielded SODIMM system includes a SODIMM connector that is at least partially housed by a SODIMM connector shield, to partially and/or substantially reduce or block RF emissions from the SODIMM connector. The SODIMM connector shield is at least partially conductive and is coupled to landing pads on a surface of a motherboard printed circuit board (“PCB”). The landing pads of the motherboard PCB that are coupled to the SODIMM connector shield are coupled to ground, which grounds the SODIMM connector shield. Grounding the SODIMM connector shield that at least partially houses the SODIMM connector reduces RF emissions from the SODIMM connector during information transfer operations.
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