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1.发明申请公开(公告)号：US20200286804A1
公开(公告)日：2020-09-10
申请号：US16292218
申请日：2019-03-04
Applicant: Intel Corporation
Inventor： John FALLIN , Daniel J. RAGLAND , Jonathan P. DOUGLAS
IPC: H01L23/34 , G06F11/14 , G06F1/20 , H01L23/473
Abstract: Circuitry to apply heat to a die while the die junction temperature is below a minimum die junction temperature of an operating die junction temperature range for the die is provided. The circuitry to avoid a system boot failure when the die junction temperature is below the operating die junction temperature range of the die.
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