公开(公告)号：US20200328195A1

公开(公告)日：2020-10-15

申请号：US16379607

申请日：2019-04-09

Applicant: Intel Corporation

Inventor： John FALLIN ,  Daniel WILLIS

IPC: H01L25/16 ,  H01L23/00 ,  H01L23/31 ,  H01L23/42 ,  H01L23/522 ,  H01L49/02

Abstract: Embodiments include semiconductor packages. A semiconductor package includes a plurality of dies on a package substrate, and a plurality of smart dies on the package substrate, where the plurality of smart dies include a plurality of interconnects and a plurality of capacitors. The semiconductor package also includes a plurality of routing lines coupled to the dies and the smart dies, where the routing lines are communicatively coupled to the interconnects of the smart dies, where each of the dies has at least two or more routing lines to communicatively couple the dies together, and where one of the routing lines is via the interconnects of the smart dies. The capacitors may be a plurality of metal-insulator-metal (MIM) capacitors. The dies may be a plurality of active dies. The routing lines may communicatively couple first and second active dies to first and second smart dies.

公开(公告)号：US20220150006A1

公开(公告)日：2022-05-12

申请号：US17093679

申请日：2020-11-10

Applicant: Intel Corporation

Inventor： Michael SHUSTERMAN ,  John FALLIN ,  Ana M. YEPES ,  Dong-Ho HAN ,  Nasser A. KURD ,  Tomer LEVY ,  Ehud RESHEF ,  Arik GIHON ,  Ido OUZIELI ,  Yevgeni SABIN ,  Maor TAL ,  Zhongsheng WANG ,  Amit ZEEVI

IPC: H04L5/00 ,  H04W72/04

Abstract: A wireless communication device for communicating across a wireless communication channel includes one or more processors configured to determine whether a further device is generating a radio frequency interference at an operating frequency; transmit a request message to the further device requesting the further device vacate the operating frequency based on the determination that the further device is generating radio frequency interference; receive a response message from the further device; and generate an instruction based on the response message.

公开(公告)号：US20200286804A1

公开(公告)日：2020-09-10

申请号：US16292218

申请日：2019-03-04

Applicant: Intel Corporation

Inventor： John FALLIN ,  Daniel J. RAGLAND ,  Jonathan P. DOUGLAS

IPC: H01L23/34 ,  G06F11/14 ,  G06F1/20 ,  H01L23/473

Abstract: Circuitry to apply heat to a die while the die junction temperature is below a minimum die junction temperature of an operating die junction temperature range for the die is provided. The circuitry to avoid a system boot failure when the die junction temperature is below the operating die junction temperature range of the die.