公开(公告)号：US20230209759A1

公开(公告)日：2023-06-29

申请号：US18112953

申请日：2023-02-22

申请人： Intel Corporation

发明人： Karumbu MEYYAPPAN ,  Kyle ARRINGTON ,  David CRAIG ,  Pooya TADAYON

IPC分类号： H05K7/14 ,  H05K7/20 ,  H01L23/22

CPC分类号： H05K7/1481 ,  H05K7/20272 ,  H01L23/22

摘要： Embodiments disclosed herein include an electronic package. In an embodiment, the electronic package comprises a package substrate having a first surface and a second surface opposite from the first surface, and a die on the first surface of the package substrate. In an embodiment, the electronic package further comprises a socket interface on the second surface of the package substrate. In an embodiment, the socket interface comprises a first layer, wherein the first layer comprises a plurality of wells, a liquid metal within the plurality of wells, and a second layer over the plurality of wells.

公开(公告)号：US20210392774A1

公开(公告)日：2021-12-16

申请号：US16902048

申请日：2020-06-15

申请人： Intel Corporation

发明人： Karumbu MEYYAPPAN ,  Kyle ARRINGTON ,  David CRAIG ,  Pooya TADAYON

IPC分类号： H05K7/14 ,  H05K7/20

摘要： Embodiments disclosed herein include an electronic package. In an embodiment, the electronic package comprises a package substrate having a first surface and a second surface opposite from the first surface, and a die on the first surface of the package substrate. In an embodiment, the electronic package further comprises a socket interface on the second surface of the package substrate. In an embodiment, the socket interface comprises a first layer, wherein the first layer comprises a plurality of wells, a liquid metal within the plurality of wells, and a second layer over the plurality of wells.