公开(公告)号：US20230209759A1

公开(公告)日：2023-06-29

申请号：US18112953

申请日：2023-02-22

Applicant: Intel Corporation

Inventor： Karumbu MEYYAPPAN ,  Kyle ARRINGTON ,  David CRAIG ,  Pooya TADAYON

IPC: H05K7/14 ,  H05K7/20 ,  H01L23/22

CPC classification number: H05K7/1481 ,  H05K7/20272 ,  H01L23/22

Abstract: Embodiments disclosed herein include an electronic package. In an embodiment, the electronic package comprises a package substrate having a first surface and a second surface opposite from the first surface, and a die on the first surface of the package substrate. In an embodiment, the electronic package further comprises a socket interface on the second surface of the package substrate. In an embodiment, the socket interface comprises a first layer, wherein the first layer comprises a plurality of wells, a liquid metal within the plurality of wells, and a second layer over the plurality of wells.

公开(公告)号：US20210392774A1

公开(公告)日：2021-12-16

申请号：US16902048

申请日：2020-06-15

Applicant: Intel Corporation

Inventor： Karumbu MEYYAPPAN ,  Kyle ARRINGTON ,  David CRAIG ,  Pooya TADAYON

IPC: H05K7/14 ,  H05K7/20

Abstract: Embodiments disclosed herein include an electronic package. In an embodiment, the electronic package comprises a package substrate having a first surface and a second surface opposite from the first surface, and a die on the first surface of the package substrate. In an embodiment, the electronic package further comprises a socket interface on the second surface of the package substrate. In an embodiment, the socket interface comprises a first layer, wherein the first layer comprises a plurality of wells, a liquid metal within the plurality of wells, and a second layer over the plurality of wells.

公开(公告)号：US20240404896A1

公开(公告)日：2024-12-05

申请号：US18204212

申请日：2023-05-31

Applicant: Intel Corporation

Inventor： Eric ERIKE ,  Srikant NEKKANTY ,  Karumbu MEYYAPPAN ,  Anikki GIESSLER

IPC: H01L23/13 ,  H01L21/48 ,  H01L23/498

Abstract: Embodiments described herein include a liquid metal carrier. In an embodiment, the liquid metal carrier includes a substrate that is a polymer. In an embodiment, a first opening is provided through the substrate with a first shape, and a second opening is provided through the substrate with a second shape. In an embodiment, the first shape is different than the second shape.

公开(公告)号：US20250149414A1

公开(公告)日：2025-05-08

申请号：US18504352

申请日：2023-11-08

Applicant: Intel Corporation

Inventor： Ziyin LIN ,  Karumbu MEYYAPPAN ,  Gregorio R. MURTAGIAN ,  Dingying David XU

IPC: H01L23/498 ,  H01L23/00

Abstract: Embodiments disclosed herein include an interconnect structure. In an embodiment, the interconnect structure is an apparatus that comprises a substrate with a well through a thickness of the substrate. In an embodiment, the substrate comprises a polymer foam. In an embodiment, a liquid metal is in the opening, and the liquid metal comprises voids.

公开(公告)号：US20240388018A1

公开(公告)日：2024-11-21

申请号：US18199269

申请日：2023-05-18

Applicant: Intel Corporation

Inventor： Karumbu MEYYAPPAN ,  Gregorio R. MURTAGIAN ,  Ziyin LIN

IPC: H01R12/52 ,  H01L23/498 ,  H01R3/08 ,  H05K1/18 ,  H05K3/32

Abstract: Embodiments disclosed herein include an electronic package. In an embodiment, the electronic package comprises a package substrate with a first surface and a second surface opposite from the first surface. In an embodiment, pads are on the first surface of the package substrate, where the pads have a first width. In an embodiment, a layer is on the first surface of the package substrate, where the layer comprises wells through the layer, and where the wells have a second width that is wider than the first width. In an embodiment, a liquid metal is in the wells and in contact with the pads.

公开(公告)号：US20240363520A1

公开(公告)日：2024-10-31

申请号：US18139083

申请日：2023-04-25

Applicant: Intel Corporation

Inventor： Ziyin LIN ,  Boer LIU ,  Dingying David XU ,  Karumbu MEYYAPPAN

IPC: H01L23/498 ,  H01R12/52

CPC classification number: H01L23/49894 ,  H01L23/49811 ,  H01L23/49833 ,  H01R12/52 ,  H01L24/16 ,  H01L24/32 ,  H01L24/73 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01R4/2406 ,  H01R12/58 ,  H05K1/181 ,  H05K2201/10189 ,  H05K2201/10378

Abstract: Embodiments disclosed herein include a package substrate. In an embodiment, the package substrate comprises a substrate with a layer on the substrate. In an embodiment, the layer comprises a plurality of wells. In an embodiment, a liquid metal is in the plurality of wells. In an embodiment, a cap is on the layer to seal the plurality of wells, where the cap comprises a polymer, and fibers within the polymer.