公开(公告)号：US11940678B2

公开(公告)日：2024-03-26

申请号：US17131470

申请日：2020-12-22

Applicant: Intel Corporation

Inventor： Mengyuan Huang ,  David Patel ,  Kejia Li ,  Wei Qian ,  Ansheng Liu

IPC: G02F1/025

CPC classification number: G02F1/025 ,  G02F2201/063 ,  G02F2202/105

Abstract: An optical modulator includes a substrate, a first dielectric layer over the substrate, a rib waveguide including a PN junction on the first dielectric, a second dielectric layer over the rib waveguide and a stressor layer including a metal, where the first or the second dielectric is between the stressor layer and the PN junction.

公开(公告)号：US20220019098A1

公开(公告)日：2022-01-20

申请号：US17131470

申请日：2020-12-22

Applicant: Intel Corporation

Inventor： Mengyuan Huang ,  David Patel ,  Kejia Li ,  Wei Qian ,  Ansheng Liu

IPC: G02F1/025

Abstract: An optical modulator includes a substrate, a first dielectric layer over the substrate, a rib waveguide including a PN junction on the first dielectric, a second dielectric layer over the rib waveguide and a stressor layer including a metal, where the first or the second dielectric is between the stressor layer and the PN junction.

公开(公告)号：US10444551B2

公开(公告)日：2019-10-15

申请号：US16231217

申请日：2018-12-21

Applicant: Intel Corporation

Inventor： Jeffrey B. Driscoll ,  Ling Liao ,  David Patel

IPC: G02B6/26 ,  G02F1/025 ,  H01P3/08

Abstract: Embodiments may relate to a transmission line to be coupled with an electromagnetic waveguide. The transmission line may include a signal node with a first contact, a second contact, and a via between first contact and the second contact. The transmission line may further include a ground node with a third contact, a fourth contact, and a via between the third contact and the fourth contact. Other embodiments may be described or claimed.

公开(公告)号：US20190146247A1

公开(公告)日：2019-05-16

申请号：US16231217

申请日：2018-12-21

Applicant: Intel Corporation

Inventor： Jeffrey B. Driscoll ,  Ling Liao ,  David Patel

IPC: G02F1/025 ,  H01P3/08

CPC classification number: G02F1/025 ,  G02F1/0344 ,  H01P3/08

Abstract: Embodiments may relate to a transmission line to be coupled with an electromagnetic waveguide. The transmission line may include a signal node with a first contact, a second contact, and a via between first contact and the second contact. The transmission line may further include a ground node with a third contact, a fourth contact, and a via between the third contact and the fourth contact. Other embodiments may be described or claimed.