公开(公告)号：US11940678B2

公开(公告)日：2024-03-26

申请号：US17131470

申请日：2020-12-22

Applicant: Intel Corporation

Inventor： Mengyuan Huang ,  David Patel ,  Kejia Li ,  Wei Qian ,  Ansheng Liu

IPC: G02F1/025

CPC classification number: G02F1/025 ,  G02F2201/063 ,  G02F2202/105

Abstract: An optical modulator includes a substrate, a first dielectric layer over the substrate, a rib waveguide including a PN junction on the first dielectric, a second dielectric layer over the rib waveguide and a stressor layer including a metal, where the first or the second dielectric is between the stressor layer and the PN junction.

公开(公告)号：US20220019098A1

公开(公告)日：2022-01-20

申请号：US17131470

申请日：2020-12-22

Applicant: Intel Corporation

Inventor： Mengyuan Huang ,  David Patel ,  Kejia Li ,  Wei Qian ,  Ansheng Liu

IPC: G02F1/025

Abstract: An optical modulator includes a substrate, a first dielectric layer over the substrate, a rib waveguide including a PN junction on the first dielectric, a second dielectric layer over the rib waveguide and a stressor layer including a metal, where the first or the second dielectric is between the stressor layer and the PN junction.