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1.发明授权公开(公告)号：US11266043B2
公开(公告)日：2022-03-01
申请号：US15913462
申请日：2018-03-06
Applicant: Intel Corporation
Inventor： Annie Chen , David Rodriguez , Barrett M. Faneuf , Juan G. Cevallos
Abstract: Embodiments include apparatuses, methods, and systems for managing thermal energy of a computing device. An apparatus may include a heat pipe physically and thermally attached to a container by a retainer. The container may include a plurality of slots to removably receive various plurality of pluggable circuit modules during a lifetime of the container. The heat pipe may facilitate a liquid coolant flow to remove thermal energy from a plurality of pluggable circuit modules removably received into the plurality of slots of the container. The retainer may have a tensile strength sufficient to withstand repeated receiving and removal of the various plurality of pluggable circuit modules during the lifetime of the container, without degrading the thermal attachment of the heat pipe to the container below a design performance threshold. Other embodiments may also be described and claimed.
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公开(公告)号：US20210216121A1
公开(公告)日：2021-07-15
申请号：US17214230
申请日：2021-03-26
Applicant: Intel Corporation
Inventor： Kristin L. Weldon , David Rodriguez , Jin Yang , David Shia , Jimmy Chuang , Mohanraj Prabhugoud , Mark Edmund Sprenger
Abstract: Techniques for liquid cooling interfaces with rotatable connector assemblies are disclosed. In one embodiment, a collar contacts flanges on two components of a connector assembly, preventing them from separating. In another embodiment, a housing is positioned around a stem component. The stem component has a gap between a top part and a bottom part held apart by pillars, allowing water to flow to a tubing fitting connected to the housing. A retainer on top of the stem component holds the housing in place. In yet another embodiment, an internal retainer holds a housing component in place over a stem. Other embodiments are disclosed.
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公开(公告)号：US12248344B2
公开(公告)日：2025-03-11
申请号：US17214230
申请日：2021-03-26
Applicant: Intel Corporation
Inventor： Kristin L. Weldon , David Rodriguez , Jin Yang , David Shia , Jimmy Chuang , Mohanraj Prabhugoud , Mark Edmund Sprenger
Abstract: Techniques for liquid cooling interfaces with rotatable connector assemblies are disclosed. In one embodiment, a collar contacts flanges on two components of a connector assembly, preventing them from separating. In another embodiment, a housing is positioned around a stem component. The stem component has a gap between a top part and a bottom part held apart by pillars, allowing water to flow to a tubing fitting connected to the housing. A retainer on top of the stem component holds the housing in place. In yet another embodiment, an internal retainer holds a housing component in place over a stem. Other embodiments are disclosed.
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4.发明申请公开(公告)号：US20190045656A1
公开(公告)日：2019-02-07
申请号：US15913462
申请日：2018-03-06
Applicant: Intel Corporation
Inventor： Annie Chen , David Rodriguez , Barrett M. Faneuf , Juan G. Cevallos
Abstract: Embodiments include apparatuses, methods, and systems for managing thermal energy of a computing device. An apparatus may include a heat pipe physically and thermally attached to a container by a retainer. The container may include a plurality of slots to removably receive various plurality of pluggable circuit modules during a lifetime of the container. The heat pipe may facilitate a liquid coolant flow to remove thermal energy from a plurality of pluggable circuit modules removably received into the plurality of slots of the container. The retainer may have a tensile strength sufficient to withstand repeated receiving and removal of the various plurality of pluggable circuit modules during the lifetime of the container, without degrading the thermal attachment of the heat pipe to the container below a design performance threshold. Other embodiments may also be described and claimed.
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