-
公开(公告)号：US10945353B2
公开(公告)日：2021-03-09
申请号：US15711468
申请日：2017-09-21
Applicant: Intel Corporation
Inventor： Barrett M. Faneuf , Annie Chen , Jessica Gulbrand , Devdatta P. Kulkarni , Kristin L. Weldon , Joseph Andrew Broderick
Abstract: Embodiments described herein may include apparatuses, systems and/or processes to provide a mechanism with a folded wrapping to mate with a circuit board and a heatsink to enclose and seal a volume between the circuit board and the heatsink. The mechanism with the folded wrapping may be dimensioned to enclose and seal the volume with the volume having a size to accommodate one or more processors to be disposed within the volume, electrically coupled to the circuit board and thermally coupled to the heatsink. On enclosing and sealing the volume, the mechanism with the folded wrapping may keep coolant from reaching the one or more processors when the circuit board, the mechanism, and the heatsink are immersed in the coolant. Other embodiments may be described and/or claimed.
-
2.发明申请公开(公告)号：US20190045656A1
公开(公告)日：2019-02-07
申请号：US15913462
申请日：2018-03-06
Applicant: Intel Corporation
Inventor： Annie Chen , David Rodriguez , Barrett M. Faneuf , Juan G. Cevallos
Abstract: Embodiments include apparatuses, methods, and systems for managing thermal energy of a computing device. An apparatus may include a heat pipe physically and thermally attached to a container by a retainer. The container may include a plurality of slots to removably receive various plurality of pluggable circuit modules during a lifetime of the container. The heat pipe may facilitate a liquid coolant flow to remove thermal energy from a plurality of pluggable circuit modules removably received into the plurality of slots of the container. The retainer may have a tensile strength sufficient to withstand repeated receiving and removal of the various plurality of pluggable circuit modules during the lifetime of the container, without degrading the thermal attachment of the heat pipe to the container below a design performance threshold. Other embodiments may also be described and claimed.
-
3.发明授权公开(公告)号：US11266043B2
公开(公告)日：2022-03-01
申请号：US15913462
申请日：2018-03-06
Applicant: Intel Corporation
Inventor： Annie Chen , David Rodriguez , Barrett M. Faneuf , Juan G. Cevallos
Abstract: Embodiments include apparatuses, methods, and systems for managing thermal energy of a computing device. An apparatus may include a heat pipe physically and thermally attached to a container by a retainer. The container may include a plurality of slots to removably receive various plurality of pluggable circuit modules during a lifetime of the container. The heat pipe may facilitate a liquid coolant flow to remove thermal energy from a plurality of pluggable circuit modules removably received into the plurality of slots of the container. The retainer may have a tensile strength sufficient to withstand repeated receiving and removal of the various plurality of pluggable circuit modules during the lifetime of the container, without degrading the thermal attachment of the heat pipe to the container below a design performance threshold. Other embodiments may also be described and claimed.
-
-
Search Results
3
records
(took 0.011 seconds)
