公开(公告)号：US20240128253A1

公开(公告)日：2024-04-18

申请号：US18399178

申请日：2023-12-28

Applicant: Intel Corporation

Inventor： Denis MYASISHCHEV ,  Andrew V. MAZUR ,  Purushotham Kaushik MUTHUR SRINATH ,  Robert M. NICKERSON ,  Shripad GOKHALE

IPC: H01L25/18 ,  H01L23/31 ,  H01L25/065

CPC classification number: H01L25/18 ,  H01L23/3121 ,  H01L23/3135 ,  H01L23/3142 ,  H01L23/315 ,  H01L25/0657 ,  H01L2225/0651 ,  H01L2225/06562 ,  H01L2225/06582 ,  H01L2225/06589

Abstract: Embodiments disclosed herein include electronic packages. In an embodiment, the electronic package comprises a mold layer and a die embedded in the mold layer. In an embodiment the electronic package further comprises a solder resist with a first surface over the mold layer and a second surface opposite from the first surface. In an embodiment, the second surface comprises a first cavity into the solder resist.

公开(公告)号：US20210066273A1

公开(公告)日：2021-03-04

申请号：US16557771

申请日：2019-08-30

Applicant: Intel Corporation

Inventor： Denis MYASISHCHEV ,  Andrew V. MAZUR ,  Purushotham Kaushik MUTHUR SRINATH ,  Robert M. NICKERSON ,  Shripad GOKHALE

IPC: H01L25/18 ,  H01L23/31 ,  H01L25/065

Abstract: Embodiments disclosed herein include electronic packages. In an embodiment, the electronic package comprises a mold layer and a die embedded in the mold layer. In an embodiment the electronic package further comprises a solder resist with a first surface over the mold layer and a second surface opposite from the first surface. In an embodiment, the second surface comprises a first cavity into the solder resist.