公开(公告)号：US20250106997A1

公开(公告)日：2025-03-27

申请号：US18373088

申请日：2023-09-26

Applicant: Intel Corporation

Inventor： Ehsan ZAMANI ,  Umesh PRASAD ,  Logan MYERS ,  Shayan KAVIANI ,  Darko GRUJICIC ,  Elham TAVAKOLI ,  Mahdi MOHAMMADIGHALENI ,  Rengarajan SHANMUGAM ,  Rachel Guia GIRON ,  Srinivas Venkata Ramanuja PIETAMBARAM ,  Gang DUAN

IPC: H05K1/11 ,  H01L23/15 ,  H01L23/498 ,  H05K1/03

Abstract: Embodiments disclosed herein include glass cores with through glass vias (TGVs). In an embodiment, an apparatus comprises a substrate that is a solid glass layer. In an embodiment, an opening is provided through a thickness of the substrate, and a liner with a first surface is on a sidewall of the opening and a second surface is facing away from the sidewall of the opening. In an embodiment, the liner comprises a matrix, and filler particles in the matrix. In an embodiment, a plurality of cavities are provided into the second surface of the liner. In an embodiment, a via is in the opening, where the via is electrically conductive.