公开(公告)号：US20240176167A1

公开(公告)日：2024-05-30

申请号：US18071246

申请日：2022-11-29

Applicant: Intel Corporation

Inventor： Benjamin DUONG ,  Kristof DARMAWIKARTA ,  Tolga ACIKALIN ,  Harel FRISH ,  Sandeep GAAN ,  John HECK ,  Eric J. M. MORET ,  Suddhasattwa NAD ,  Haisheng RONG

IPC: G02F1/01 ,  G02B6/125

CPC classification number: G02F1/0113 ,  G02B6/125 ,  G02F1/0147 ,  G02B2006/12145

Abstract: Embodiments disclosed herein include a package substrate. In an embodiment, the package substrate comprises a core where the core comprises glass. In an embodiment, the package substrate further comprises an optical waveguide over the core, and an optical phase change material over the optical waveguide.