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公开(公告)号：US20180158796A1
公开(公告)日：2018-06-07
申请号：US15822364
申请日：2017-11-27
IPC分类号： H01L23/00 , H01L21/683 , H01L21/677 , H01L21/67 , B32B37/10 , B32B41/00 , B32B37/00
CPC分类号： H01L24/75 , B32B15/01 , B32B37/0046 , B32B37/10 , B32B41/00 , B32B2041/04 , B32B2457/14 , H01L21/187 , H01L21/2007 , H01L21/67092 , H01L21/67253 , H01L21/67259 , H01L21/67742 , H01L21/68 , H01L21/6838 , H01L24/80 , H01L24/83 , H01L2224/7515 , H01L2224/753 , H01L2224/75302 , H01L2224/75305 , H01L2224/7531 , H01L2224/7555 , H01L2224/7565 , H01L2224/75744 , H01L2224/75745 , H01L2224/75901 , H01L2224/75981 , H01L2224/75986 , H01L2224/80009 , H01L2224/80201 , H01L2224/80894 , H01L2224/80908 , H01L2224/83009 , H01L2224/83201 , H01L2224/83894 , H01L2224/83908
摘要： There is provided a bonding apparatus for bonding substrates together, which includes: a first holding part configured to adsorptively hold a first substrate by vacuum-drawing the first substrate on a lower surface of the first substrate; a second holding part provided below the first holding part and configured to adsorptively hold a second substrate by vacuum-drawing the second substrate on an upper surface of the second substrate; a pressing member provided in the first holding part and configured to press a central portion of the first substrate; and a plurality of substrate detection parts provided in the first holding part and configured to detect a detachment of the first substrate from the first holding part.
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公开(公告)号：US20160211195A1
公开(公告)日：2016-07-21
申请号：US14917095
申请日：2014-09-02
发明人： Naoya Sunachi , Hideyo Osanai , Satoru Kurita
IPC分类号： H01L23/492 , H01L21/48 , H01L23/373 , H01L23/00 , H01L23/498
CPC分类号： H01L23/4924 , H01L21/4846 , H01L21/4878 , H01L23/3735 , H01L23/3736 , H01L23/498 , H01L24/29 , H01L24/32 , H01L24/83 , H01L2224/04026 , H01L2224/05644 , H01L2224/27442 , H01L2224/29139 , H01L2224/29339 , H01L2224/29394 , H01L2224/32225 , H01L2224/32245 , H01L2224/75315 , H01L2224/83009 , H01L2224/83192 , H01L2224/83203 , H01L2224/83385 , H01L2224/83447 , H01L2224/8384 , H01L2924/01046 , H01L2924/01047 , H01L2924/01079 , H05K1/053 , H05K3/3431 , H05K2203/0307 , Y02P70/613 , H01L2924/00014 , H01L2924/00012
摘要： In a method for producing an electronic part mounting substrate wherein an electronic part 14 is mounted on one major surface (a surface to which the electronic part 14 is to be bonded) of the metal plate 10 of copper, or aluminum or the aluminum alloy (when a plating film 20 of copper is formed on the surface), the one major surface of the metal plate 10 (or the surface of the plating film 20 of copper) is surface-machined to be coarsened so as to have a surface roughness of not less than 0.4 μm, and then, a silver paste is applied on the surface-machined major surface (or the surface-machined surface of the plating film 20 of copper) to arrange the electronic part 14 thereon to sinter silver in the silver paste to form a silver bonding layer 12 to bond the electronic part 14 to the one major surface of the metal plate 10 (or the surface of the plating film 20 of copper) with the silver bonding layer 12.
摘要翻译： 在电子部件安装基板的制造方法中，电子部件14安装在铜或铝或铝合金的金属板10的一个主表面（电子部件14的要被接合的表面）上 当在表面上形成铜的镀膜20时），将金属板10的一个主表面（或铜的镀膜20的表面）进行表面加工，粗化，使其表面粗糙度 不小于0.4μm，然后在表面加工的主表面（或铜的镀膜20的表面加工表面）上施加银膏，以将电子部件14布置在银膏中烧结银 形成银结合层12，用银接合层12将电子部件14与金属板10的一个主表面（或铜的镀膜20的表面）接合。
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公开(公告)号：US11648750B2
公开(公告)日：2023-05-16
申请号：US16944877
申请日：2020-07-31
申请人： IMMUNOLIGHT, LLC
IPC分类号： B32B7/12 , B32B27/16 , B32B5/02 , B32B5/18 , B32B5/26 , B32B7/06 , B32B9/02 , B32B9/04 , B32B17/00 , B32B18/00 , B32B21/04 , B32B25/04 , B32B27/08 , B32B27/30 , B32B27/32 , B32B27/34 , B32B27/36 , B32B37/12 , B32B38/00 , C09J11/06 , C09J133/00 , C09J133/06 , H01L23/00 , C09J7/10
CPC分类号： B32B7/12 , B32B5/02 , B32B5/18 , B32B5/26 , B32B7/06 , B32B9/025 , B32B9/04 , B32B9/043 , B32B17/00 , B32B18/00 , B32B21/042 , B32B25/045 , B32B27/08 , B32B27/16 , B32B27/302 , B32B27/304 , B32B27/308 , B32B27/32 , B32B27/322 , B32B27/34 , B32B27/36 , B32B37/12 , B32B38/0008 , C09J7/10 , C09J11/06 , C09J133/00 , C09J133/06 , H01L24/00 , H01L24/03 , H01L24/05 , H01L24/29 , H01L24/83 , B32B2037/1253 , B32B2255/26 , B32B2305/18 , B32B2307/202 , B32B2307/204 , B32B2307/21 , B32B2307/3065 , B32B2307/41 , B32B2307/412 , B32B2307/422 , B32B2307/50 , B32B2307/546 , B32B2307/548 , B32B2307/552 , B32B2307/706 , B32B2307/72 , B32B2307/748 , B32B2307/75 , B32B2310/0806 , B32B2439/00 , B32B2439/70 , B32B2439/80 , B32B2457/14 , B32B2479/00 , B32B2605/003 , B32B2605/08 , H01L24/27 , H01L24/32 , H01L24/94 , H01L2224/0383 , H01L2224/03831 , H01L2224/04026 , H01L2224/05791 , H01L2224/05887 , H01L2224/2711 , H01L2224/2732 , H01L2224/27334 , H01L2224/27416 , H01L2224/27418 , H01L2224/27436 , H01L2224/27618 , H01L2224/27622 , H01L2224/293 , H01L2224/2919 , H01L2224/2929 , H01L2224/29083 , H01L2224/29291 , H01L2224/29387 , H01L2224/32145 , H01L2224/32225 , H01L2224/32245 , H01L2224/32258 , H01L2224/83009 , H01L2224/83591 , H01L2224/83687 , H01L2224/83851 , H01L2224/83855 , H01L2224/83868 , H01L2224/83874 , H01L2224/94 , H01L2924/0569
摘要： A method of and system for adhesive bonding by a) providing a polymerizable adhesive composition on a surface of an element to be bonded to form an assembly; b) irradiating the assembly with radiation at a first wavelength capable of vulcanization of bonds in the polymerizable adhesive composition by activation of sulfur-containing compound with at least one selected from x-ray, e-beam, visible, or infrared light to thereby generate ultraviolet light in the polymerizable adhesive composition; and c) adhesively joining two or more components together by way of the polymerizable adhesive composition, and a curable polymer for use therein.
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公开(公告)号：US09831157B2
公开(公告)日：2017-11-28
申请号：US14917095
申请日：2014-09-02
发明人： Naoya Sunachi , Hideyo Osanai , Satoru Kurita
IPC分类号： H01L21/00 , H01L23/48 , H01L23/492 , H01L23/373 , H05K3/34 , H01L21/48 , H01L23/498 , H05K1/05 , H01L23/00
CPC分类号： H01L23/4924 , H01L21/4846 , H01L21/4878 , H01L23/3735 , H01L23/3736 , H01L23/498 , H01L24/29 , H01L24/32 , H01L24/83 , H01L2224/04026 , H01L2224/05644 , H01L2224/27442 , H01L2224/29139 , H01L2224/29339 , H01L2224/29394 , H01L2224/32225 , H01L2224/32245 , H01L2224/75315 , H01L2224/83009 , H01L2224/83192 , H01L2224/83203 , H01L2224/83385 , H01L2224/83447 , H01L2224/8384 , H01L2924/01046 , H01L2924/01047 , H01L2924/01079 , H05K1/053 , H05K3/3431 , H05K2203/0307 , Y02P70/613 , H01L2924/00014 , H01L2924/00012
摘要： In a method for producing an electronic part mounting substrate wherein an electronic part 14 is mounted on one major surface (a surface to which the electronic part 14 is to be bonded) of the metal plate 10 of copper, or aluminum or the aluminum alloy (when a plating film 20 of copper is formed on the surface), the one major surface of the metal plate 10 (or the surface of the plating film 20 of copper) is surface-machined to be coarsened so as to have a surface roughness of not less than 0.4 μm, and then, a silver paste is applied on the surface-machined major surface (or the surface-machined surface of the plating film 20 of copper) to arrange the electronic part 14 thereon to sinter silver in the silver paste to form a silver bonding layer 12 to bond the electronic part 14 to the one major surface of the metal plate 10 (or the surface of the plating film 20 of copper) with the silver bonding layer 12.
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公开(公告)号：US20170179114A1
公开(公告)日：2017-06-22
申请号：US15388617
申请日：2016-12-22
IPC分类号： H01L27/06 , H01L21/324 , H01L21/02 , H01L21/265 , H01L23/00
CPC分类号： H01L27/0688 , H01L21/02672 , H01L21/02686 , H01L21/185 , H01L21/26506 , H01L21/324 , H01L21/76251 , H01L21/76254 , H01L21/8221 , H01L24/83 , H01L2224/29186 , H01L2224/83005 , H01L2224/83009 , H01L2224/83379 , H01L2224/83896 , H01L2224/83948 , H01L2924/01014 , H01L2924/05442
摘要： This method comprises the following steps: a) providing a first structure successively comprising a first substrate, a first electronic device, and a first dielectric layer; a second structure successively comprising a second substrate, an active layer, a second dielectric layer, and a polycrystalline semiconductor layer, the active layer being designed to form a second electronic device; b) bombarding the polycrystalline semiconductor layer by a beam of species configured to form an amorphous part and to preserve a superficial polycrystalline part; c) bonding the first and second structures; d) removing the second substrate of the second structure; e) introducing dopants into the amorphous part, through the exposed active layer; f) thermally activating the dopants by recrystallization of the amorphous part.
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公开(公告)号：US20170154866A1
公开(公告)日：2017-06-01
申请号：US15322928
申请日：2015-06-29
申请人： IMMUNOLIGHT, LLC
CPC分类号： H01L24/83 , B32B5/02 , B32B5/18 , B32B5/26 , B32B7/06 , B32B7/12 , B32B9/025 , B32B9/04 , B32B9/043 , B32B17/00 , B32B18/00 , B32B21/042 , B32B25/045 , B32B27/08 , B32B27/16 , B32B27/302 , B32B27/304 , B32B27/308 , B32B27/32 , B32B27/322 , B32B27/34 , B32B27/36 , B32B37/12 , B32B38/0008 , B32B2037/1253 , B32B2255/26 , B32B2305/18 , B32B2307/202 , B32B2307/204 , B32B2307/21 , B32B2307/3065 , B32B2307/41 , B32B2307/412 , B32B2307/422 , B32B2307/50 , B32B2307/546 , B32B2307/548 , B32B2307/552 , B32B2307/706 , B32B2307/72 , B32B2307/748 , B32B2307/75 , B32B2310/0806 , B32B2439/00 , B32B2439/70 , B32B2439/80 , B32B2457/14 , B32B2479/00 , B32B2605/003 , B32B2605/08 , C09J11/06 , C09J133/00 , C09J133/06 , H01L24/00 , H01L24/03 , H01L24/05 , H01L24/27 , H01L24/29 , H01L24/32 , H01L24/94 , H01L2224/0383 , H01L2224/03831 , H01L2224/04026 , H01L2224/05791 , H01L2224/05887 , H01L2224/2711 , H01L2224/2732 , H01L2224/27334 , H01L2224/27416 , H01L2224/27418 , H01L2224/27436 , H01L2224/27618 , H01L2224/27622 , H01L2224/29083 , H01L2224/2919 , H01L2224/2929 , H01L2224/29291 , H01L2224/293 , H01L2224/29387 , H01L2224/32145 , H01L2224/32225 , H01L2224/32245 , H01L2224/83009 , H01L2224/83591 , H01L2224/83687 , H01L2224/83851 , H01L2224/83855 , H01L2224/83868 , H01L2224/83874 , H01L2224/94 , H01L2924/00012 , H01L2224/83 , H01L2924/00014 , H01L2924/07802 , H01L2924/0781
摘要： A method of and system for adhesive bonding. The method and system a) treat a surface of an element to be bonded to provide an adherent structure including one or more rubber compounds on the surface; b) place a polymerizable adhesive composition, including at least one photoinitiator and at least one energy converting material, in contact with the adherent structure and two or more components to be bonded to form an assembly, c) irradiated the assembly with radiation at a first wavelength, capable of conversion by the at least one energy converting material, to a second wavelength capable of activating the at least one photoinitiator to produce from the polymerizable adhesive composition a cured adhesive composition; and d) adhesively join the two or more components by way of the adherent structure and the cured adhesive composition.
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公开(公告)号：US20230378124A1
公开(公告)日：2023-11-23
申请号：US17750825
申请日：2022-05-23
申请人： Intel Corporation
IPC分类号： H01L23/00
CPC分类号： H01L24/83 , H01L24/32 , H01L24/73 , H01L24/29 , H01L24/26 , H01L24/92 , H01L2224/32225 , H01L2224/16225 , H01L2224/73204 , H01L2224/2919 , H01L2924/0665 , H01L2224/2929 , H01L2224/29386 , H01L2924/05442 , H01L2224/83102 , H01L2224/83379 , H01L2224/83375 , H01L24/14 , H01L2224/14152 , H01L24/16 , H01L24/13 , H01L2224/13111 , H01L2224/13147 , H01L2224/83009 , H01L2224/26122 , H01L2224/92125 , H01L24/81 , H01L2224/81203 , H01L2224/81815 , H01L2224/8385 , H01L25/0655
摘要： A microelectronic assembly comprises a first microelectronic component; a second microelectronic component under an area of the first microelectronic component and coupled to the first component through first interconnect structures within a central region of the area, and second interconnect structures within a peripheral region of the area, adjacent to the central region. A heterogenous dielectric surface on the first or second component or both and within a gap between the first and second components has a first surface composition within the central region and at least a second surface composition within the peripheral region.
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公开(公告)号：US20180308831A1
公开(公告)日：2018-10-25
申请号：US16016977
申请日：2018-06-25
CPC分类号： H01L25/167 , H01L24/32 , H01L24/83 , H01L24/94 , H01L24/96 , H01L2224/27502 , H01L2224/29186 , H01L2224/32145 , H01L2224/83009 , H01L2224/83203 , H01L2224/83359 , H01L2224/83379 , H01L2224/83896 , H01L2924/10253 , H01L2924/1032
摘要： According to one embodiment, at first, a compound semiconductor layer is bonded to a position straddling a plurality of chip formation regions arranged on a substrate. One of the chip formation regions has a first size, and the compound semiconductor layer has a second size smaller than the first size. Thereafter, the compound semiconductor layer is processed to provide compound semiconductor elements on the chip formation regions. Then, the substrate is divided to correspond to the chip formation regions.
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公开(公告)号：US10083933B2
公开(公告)日：2018-09-25
申请号：US14976484
申请日：2015-12-21
IPC分类号： H01L23/00 , H01L21/18 , H01L21/20 , H01L21/762 , H01L21/70
CPC分类号： H01L24/83 , H01L21/187 , H01L21/2007 , H01L21/70 , H01L21/76251 , H01L24/80 , H01L2224/80907 , H01L2224/83009 , H01L2224/83894 , H01L2224/83907 , H01L2924/01001 , H01L2924/01007 , H01L2924/01008 , H01L2924/01018 , H01L2924/20102 , H01L2924/20103 , H01L2924/20104 , H01L2924/20105 , H01L2924/20106
摘要： A method for bonding of a first contact surface of a first substrate to a second contact surface of a second substrate according to the following steps: forming a reservoir in a surface layer on the first contact surface, at least partially filling the reservoir with a first educt or a first group of educts, contacting the first contact surface with the second contact surface for formation of a prebond connection, and forming a permanent bond between the first and second contact surface, at least partially strengthened by the reaction of the first educt with a second educt contained in a reaction layer of the second substrate.
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公开(公告)号：US20180247914A1
公开(公告)日：2018-08-30
申请号：US15908641
申请日：2018-02-28
申请人： IMEC VZW
发明人： Lan Peng , Soon-Wook Kim , Eric Beyne , Gerald Peter Beyer , Erik Sleeckx , Robert Miller
IPC分类号： H01L23/00 , H01L23/522 , H01L23/528
CPC分类号： H01L24/83 , H01J37/32091 , H01J37/321 , H01J2237/334 , H01L21/2007 , H01L23/5226 , H01L23/528 , H01L24/29 , H01L24/32 , H01L2224/29082 , H01L2224/29187 , H01L2224/32145 , H01L2224/83009 , H01L2224/83011 , H01L2224/83022 , H01L2224/83895 , H01L2224/83896 , H01L2224/83948 , H01L2224/83986 , H01L2924/04642 , H01L2924/059 , H01L2924/20106 , H01L2924/20107
摘要： The disclosed technology generally relates to integrating semiconductor dies and more particularly to bonding semiconductor substrates. In an aspect, a method of bonding semiconductor substrates includes providing a first substrate and a second substrate. Each of the first substrate and the second substrate comprises a dielectric bonding layer comprising one or more a silicon carbon oxide (SiCO) layer, a silicon carbon nitride (SiCN) layer or a silicon carbide (SiC) layer. The method additionally includes, prior to bonding the first and second substrates, pre-treating each of the dielectric bonding layer of the first substrate and the dielectric bonding layer of the second substrate. Pre-treating includes a first plasma activation process in a plasma comprising an inert gas, a second plasma activation process in a plasma comprising oxygen, and a wet surface treatment including a water rinsing step or an exposure to a water-containing ambient. The method additionally includes bonding the first and the second substrates by contacting the dielectric bonding layer of the first substrate and the dielectric bonding layer of the second substrate to form a substrate assembly. The method further includes post-bond annealing the assembly.
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