公开(公告)号：US20230237231A1

公开(公告)日：2023-07-27

申请号：US18191785

申请日：2023-03-28

Applicant: Intel Corporation

Inventor： Byron Sinclair ,  Michael Kinsner ,  Gabriel Quan ,  Victor Tzi-on Zhang ,  Mahesh A. Iyer ,  Chengping Liang ,  Deshanand P. Singh

IPC: G06F30/347 ,  G06F30/31

CPC classification number: G06F30/347 ,  G06F30/31

Abstract: Systems or methods of the present disclosure may provide an electronic device that includes memory storing instructions; and a processor, that when executing the instructions, is to receive a design for a programmable fabric of an integrated circuit device. The instructions are also to cause the processor to cause compilation of the design into a configuration during a compilation window. The instructions further are to cause the processor to determine at least some routing for the configuration outside of the compilation window.