公开(公告)号：US09653805B2

公开(公告)日：2017-05-16

申请号：US14445662

申请日：2014-07-29

Applicant: Intel Corporation

Inventor： Telesphor Kamgaing ,  Valluri R. Rao ,  Georgios Yorgos Palaskas

IPC: G01S19/53 ,  H01Q3/30 ,  H01Q1/22 ,  H01Q9/04 ,  H01Q21/06 ,  H01Q23/00 ,  H01L23/66 ,  H01L25/065 ,  H01L25/16 ,  H01L25/18

CPC classification number: H01Q3/30 ,  H01L23/66 ,  H01L25/0657 ,  H01L25/16 ,  H01L25/18 ,  H01L2223/6677 ,  H01L2224/13025 ,  H01L2224/14181 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2924/15321 ,  H01Q1/2283 ,  H01Q9/0414 ,  H01Q21/065 ,  H01Q23/00 ,  Y10T29/49004 ,  Y10T29/49018

Abstract: An apparatus includes a die with through-silicon vias and radio frequency integrated circuit capabilities and it is vertically integrated with a phased-array antenna substrate. The through-silicon via and a radio frequency integrated circuit is coupled to a plurality of antenna elements disposed on the phased-array antenna substrate where each of the plurality of antenna elements is coupled to the through-silicon vias and radio frequency integrated circuit through a plurality of through-silicon vias. A process of assembling the through-silicon vias and radio frequency integrated circuit to the phased-array antenna substrate includes testing the apparatus.