公开(公告)号：US20210366862A1

公开(公告)日：2021-11-25

申请号：US17392598

申请日：2021-08-03

Applicant: Intel Corporation

Inventor： Zhaozhi Li ,  Sanka Ganesan ,  Debendra Mallik ,  Gregory Perry ,  Kuan H. Lu ,  Omkar Karhade ,  Shawna M. Liff

IPC: H01L23/00

Abstract: An electronic package and method includes a substrate including a plurality of pads on a major surface. An electronic component including a plurality of pads on a major surface facing the major surface of the substrate. A stud bump electrically couples one of the plurality of pads of the substrate to one of the plurality of pads of the electronic component.

公开(公告)号：US11552035B2

公开(公告)日：2023-01-10

申请号：US17392598

申请日：2021-08-03

Applicant: Intel Corporation

Inventor： Zhaozhi Li ,  Sanka Ganesan ,  Debendra Mallik ,  Gregory Perry ,  Kuan H. Lu ,  Omkar Karhade ,  Shawna M. Liff

IPC: H01L23/00 ,  H01L23/498

Abstract: An electronic package and method includes a substrate including a plurality of pads on a major surface. An electronic component including a plurality of pads on a major surface facing the major surface of the substrate. A stud bump electrically couples one of the plurality of pads of the substrate to one of the plurality of pads of the electronic component.

公开(公告)号：US11127706B2

公开(公告)日：2021-09-21

申请号：US16145999

申请日：2018-09-28

Applicant: Intel Corporation

Inventor： Zhaozhi Li ,  Sanka Ganesan ,  Debendra Mallik ,  Gregory Perry ,  Kuan H. Lu ,  Omkar Karhade ,  Shawna M. Liff

IPC: H01L23/00

Abstract: An electronic package and method includes a substrate including a plurality of pads on a major surface. An electronic component including a plurality of pads on a major surface facing the major surface of the substrate. A stud bump electrically couples one of the plurality of pads of the substrate to one of the plurality of pads of the electronic component.