公开(公告)号：US20150333802A1

公开(公告)日：2015-11-19

申请号：US14717093

申请日：2015-05-20

Applicant: Intel Corporation

Inventor： SONGNAN YANG ,  ANAND S. KONANUR ,  ULUN KARACAOGLU ,  HAO-HAN HSU

IPC: H04B5/00 ,  H04W4/00

CPC classification number: H04B5/0043 ,  G06K7/10237 ,  H04B1/006 ,  H04B5/0012 ,  H04B5/0031 ,  H04B5/005 ,  H04B5/0081 ,  H04L25/03006 ,  H04L2025/03375 ,  H04W4/80

Abstract: Described herein are techniques related to near field coupling and proximity sensing operations. For example, a proximity sensor uses a coil antenna that is utilized for near field communications (NFC) functions. The proximity sensor may be integrated into an NFC module to form a single module.

Abstract translation: 这里描述了与近场耦合和接近感测操作有关的技术。 例如，接近传感器使用用于近场通信（NFC）功能的线圈天线。 接近传感器可以集成到NFC模块中以形成单个模块。

公开(公告)号：US20190044289A1

公开(公告)日：2019-02-07

申请号：US15900450

申请日：2018-02-20

Applicant: Intel Corporation

Inventor： XIANG LI ,  JAEJIN LEE ,  JUN LIAO ,  HAO-HAN HSU ,  GEORGE VERGIS ,  YUN LING ,  DONG-HO HAN ,  YUNHUI CHU

IPC: H01R13/6594 ,  H01R12/73 ,  H01R43/20

Abstract: A shielded SODIMM system for reducing RF emissions of a SODIMM connector is disclosed herein. SODIMM connector RFI presently interferes with connectivity and is also an obstacle for higher speed memory applications. The shielded SODIMM system includes a SODIMM connector that is at least partially housed by a SODIMM connector shield, to partially and/or substantially reduce or block RF emissions from the SODIMM connector. The SODIMM connector shield is at least partially conductive and is coupled to landing pads on a surface of a motherboard printed circuit board (“PCB”). The landing pads of the motherboard PCB that are coupled to the SODIMM connector shield are coupled to ground, which grounds the SODIMM connector shield. Grounding the SODIMM connector shield that at least partially houses the SODIMM connector reduces RF emissions from the SODIMM connector during information transfer operations.