公开(公告)号：US20180342463A1

公开(公告)日：2018-11-29

申请号：US16035048

申请日：2018-07-13

Applicant: Intel Corporation

Inventor： Taylor GAINES ,  Anna M. PRAKASH ,  Suriyakala RAMALINGAM ,  Boxi LIU ,  Mohit GUPTA ,  Ziv BELMAN ,  Baruch SCHIFFMANN ,  Arnon HIRSHBERG ,  Vladimir MALAMUD ,  Ron WITTENBERG

IPC: H01L23/552 ,  H01L23/00 ,  H01L25/16 ,  H01L25/00 ,  H01L23/31 ,  H01L31/107 ,  H01S5/022

Abstract: In various embodiments this disclosure is directed to conductive adhesives layers that can be used, in one example embodiment, to connect one or more shielding structures (for example, metal cans and/or covers) to a semiconductor package to enclose one or more electronic components on the semiconductor package. In another embodiment, the conductive adhesive layers disclosed herein can be used in connection with optoelectronic devices (for example, optoelectronic devices including laser diodes and/or avalanche photodiodes, APDs). In one embodiment, the conductive adhesives can additionally be used for thermal dissipation and for electrical contact in connection with one or more electronic components on a semiconductor package. In one embodiment, various materials including, spray prints, conductive paste, inks (for example, sintering silver-based materials), epoxy material (for example, epoxy materials filled with silver and/or other metal particles) can be used to provide a conductive adhesive layer.

公开(公告)号：US20180190593A1

公开(公告)日：2018-07-05

申请号：US15396415

申请日：2016-12-30

Applicant: Intel Corporation

Inventor： Taylor GAINES ,  Anna M. PRAKASH ,  Suriyakala RAMALINGAM ,  Boxi LIU ,  Mohit GUPTA ,  Ziv BELMAN ,  Baruch SCHIFFMANN ,  Arnon HIRSHBERG ,  Vladimir MALAMUD ,  Ron WITTENBERG

IPC: H01L23/552 ,  H01L25/00 ,  H01L25/16 ,  H01L23/31 ,  H01L23/00

CPC classification number: H01L24/83 ,  H01L23/3142 ,  H01L23/552 ,  H01L24/27 ,  H01L24/32 ,  H01L25/167 ,  H01L25/50 ,  H01L31/107 ,  H01L2224/2731 ,  H01L2224/27318 ,  H01L2224/27418 ,  H01L2224/27505 ,  H01L2224/29111 ,  H01L2224/29113 ,  H01L2224/29139 ,  H01L2224/29147 ,  H01L2224/2919 ,  H01L2224/32245 ,  H01L2224/32503 ,  H01L2224/83191 ,  H01L2224/8322 ,  H01L2224/8384 ,  H01L2224/83851 ,  H01L2924/0133 ,  H01L2924/0635 ,  H01L2924/0665 ,  H01L2924/12042 ,  H01L2924/12043 ,  H01L2924/1434 ,  H01L2924/3025

Abstract: In various embodiments this disclosure is directed to conductive adhesives layers that can be used, in one example embodiment, to connect one or more shielding structures (for example, metal cans and/or covers) to a semiconductor package to enclose one or more electronic components on the semiconductor package. In another embodiment, the conductive adhesive layers disclosed herein can be used in connection with optoelectronic devices (for example, optoelectronic devices including laser diodes and/or avalanche photodiodes, APDs). In one embodiment, the conductive adhesives can additionally be used for thermal dissipation and for electrical contact in connection with one or more electronic components on a semiconductor package. In one embodiment, various materials including, spray prints, conductive paste, inks (for example, sintering silver-based materials), epoxy material (for example, epoxy materials filled with silver and/or other metal particles) can be used to provide a conductive adhesive layer.

公开(公告)号：US20180374776A1

公开(公告)日：2018-12-27

申请号：US15774990

申请日：2016-01-11

Applicant: Intel Corporation

Inventor： Boxi LIU ,  Hemanth K. DHAVALESWARAPU ,  Syadwad JAIN ,  James C. MATAYABAS, Jr.

IPC: H01L23/373 ,  H01L23/367 ,  H01L23/00 ,  H01L25/065 ,  H01L21/48

Abstract: A multiple chip package is described with multiple thermal interface materials. In one example, a package has a substrate, a first semiconductor die coupled to the substrate, a second semiconductor die coupled to the substrate, a heat spreader coupled to the die, wherein the first die has a first distance to the heat spreader and the second die has a second distance to the heat spreader, a first filled thermal interface material (TIM) between the first die and the heat spreader to mechanically and thermally couple the heat spreader to the die, and a second filled TIM between the second die and the heat spreader to mechanically and thermally couple the heat spreader to the second die.

公开(公告)号：US20180323130A1

公开(公告)日：2018-11-08

申请号：US15771025

申请日：2015-12-22

Applicant: Intel Corporation

Inventor： Boxi LIU ,  Syadwad JAIN ,  Jelena CULIC-VISKOTA ,  Nachiket R. RARAVIKAR ,  James C. MATAYABAS, Jr.

IPC: H01L23/373 ,  C08K3/08 ,  C08L83/04 ,  C08G77/12 ,  H01L23/367 ,  C09K5/06 ,  H01L23/00

CPC classification number: H01L23/3737 ,  C08G77/12 ,  C08G77/20 ,  C08K3/08 ,  C08K5/00 ,  C08K5/56 ,  C08L83/00 ,  C08L83/04 ,  C09K5/063 ,  H01L23/34 ,  H01L23/3672 ,  H01L24/83 ,  H01L2224/8384 ,  H01L2224/83862

Abstract: An adhesive polymer thermal interface material is described with sintered fillers for thermal conductivity in micro-electronic packaging. Embodiments include a polymer thermal interface material (PTIM) with sinterable thermally conductive filler particles, a dispersant, and a silicone polymer matrix.