公开(公告)号：US20190006356A1

公开(公告)日：2019-01-03

申请号：US15988958

申请日：2018-05-24

Applicant: Intel Corporation

Inventor： Seok Ling Lim ,  Jenny Shio Yin Ong ,  Tin Poay Chuah ,  Hon Wah Chew

IPC: H01L27/08 ,  H01L23/522 ,  H01L49/02

Abstract: An apparatus is provided which comprises: one or more dielectric layers forming a substrate, one or more first conductive contacts on a top surface of the substrate, one or more second conductive contacts on a bottom surface of the substrate opposite of the top surface, and one or more discrete capacitors conductively coupled with one or more of the first and second conductive contacts, the one or more discrete capacitors embedded within the substrate between the top surface and the bottom surface. Other embodiments are also disclosed and claimed.