公开(公告)号：US20240332126A1

公开(公告)日：2024-10-03

申请号：US18129654

申请日：2023-03-31

Applicant: Intel Corporation

Inventor： Andy Wei ,  Po-Yao Ke ,  Kai-Chiang Wu ,  Han-wen Lin ,  Klaus Max Schruefer ,  Dean Huang ,  Hsin-Hua Wang

IPC: H01L23/373 ,  H01L23/367

CPC classification number: H01L23/3737 ,  H01L23/3677 ,  H01L23/3735 ,  H01L23/481

Abstract: Thermal dissipation and grounding of integrated circuit (IC) devices with backside power delivery networks are discussed. An IC device layer between frontside and backside interconnect sections, composed mostly of an insulating material, is coupled to a crystalline heat spreader or a metal thermal ground layer by an array of thermal pillars extending through the insulating material. The crystalline heat spreader layer may include one or more thermal sensors, such as thermal sensing diodes, also coupled to the IC device layer by one or more thermal pillars. The IC device layer and crystalline layers are coupled by a hybrid bond, which forms the thermal pillars through a continuous section of the insulating material.