公开(公告)号：US11094633B2

公开(公告)日：2021-08-17

申请号：US16305758

申请日：2016-06-30

Applicant: Intel Corporation

Inventor： Zhiguo Qian ,  Kemal Aygun ,  Dae-Woo Kim ,  Jackie C. Preciado

IPC: H01L23/538 ,  H01L25/065 ,  H01L23/00 ,  H01L25/18

Abstract: A microelectronic package bridge can comprising a plurality of ground layers, and a plurality of signal layers interwoven with the plurality of ground layers. Each of the signal layers can include a plurality of electrically conductive pathways. Each of the electrically conductive pathways can be arranged to form an electrical connection between one of a first plurality of bumps of a first die and one of a second plurality of bumps of a second die. Each of the plurality of electrically conductive pathways can have a length substantially equal to one another.