公开(公告)号：US20240202419A1

公开(公告)日：2024-06-20

申请号：US18538409

申请日：2023-12-13

Applicant: Intel Corporation

Inventor： Miaomiao Ma ,  Adam Norman ,  Jianfang Olena Zhu ,  Mackenzie Norman ,  Mark Gallina ,  Pei Chun Ch'ng ,  Xia Zhu ,  Jagadeesh Radhakrishnan ,  Soon Khiang Toh ,  Omer Vikinski ,  Slade Morgan

IPC: G06F30/392 ,  G06F30/27 ,  G06F115/02 ,  G06F119/08

CPC classification number: G06F30/392 ,  G06F30/27 ,  G06F2115/02 ,  G06F2119/08

Abstract: Systems, apparatuses and methods may provide for technology that determines a plurality of transient thermal responses for a corresponding plurality of power source locations on a semiconductor die, obtains corner block list (CBL) representations associated with a plurality of candidate floorplans, and conducts an artificial intelligence (AI) based search of the CBL representations, wherein an output of the AI based search is one or more suggested floorplans having a transient thermal response that is below a thermal threshold.