公开(公告)号：US20220300692A1

公开(公告)日：2022-09-22

申请号：US17835323

申请日：2022-06-08

申请人： Intel Corporation

发明人： Jin Yan ,  Adam Norman ,  Min Suet Lim ,  Mackenzie Norman ,  Hong Cheah Ho ,  Jianfang Zhu ,  Miaomiao Ma

IPC分类号： G06F30/392 ,  G06F30/398

摘要： Systems, apparatuses and methods may provide for technology that identifies a plurality of functional blocks in a circuit, wherein each functional block includes a plurality of components, conducts one or more passes of a first optimization loop to determine candidate aspect ratios for the functional blocks based on size data associated with the components, and conducts, within the one or more passes of the first optimization loop, one or more passes of a second optimization loop to determine candidate floorplan data for the circuit based on the candidate aspect ratios.

公开(公告)号：US20240202419A1

公开(公告)日：2024-06-20

申请号：US18538409

申请日：2023-12-13

申请人： Intel Corporation

发明人： Miaomiao Ma ,  Adam Norman ,  Jianfang Olena Zhu ,  Mackenzie Norman ,  Mark Gallina ,  Pei Chun Ch'ng ,  Xia Zhu ,  Jagadeesh Radhakrishnan ,  Soon Khiang Toh ,  Omer Vikinski ,  Slade Morgan

IPC分类号： G06F30/392 ,  G06F30/27 ,  G06F115/02 ,  G06F119/08

CPC分类号： G06F30/392 ,  G06F30/27 ,  G06F2115/02 ,  G06F2119/08

摘要： Systems, apparatuses and methods may provide for technology that determines a plurality of transient thermal responses for a corresponding plurality of power source locations on a semiconductor die, obtains corner block list (CBL) representations associated with a plurality of candidate floorplans, and conducts an artificial intelligence (AI) based search of the CBL representations, wherein an output of the AI based search is one or more suggested floorplans having a transient thermal response that is below a thermal threshold.

公开(公告)号：US20230385507A1

公开(公告)日：2023-11-30

申请号：US18326772

申请日：2023-05-31

申请人： Intel Corporation

发明人： Jianfang Zhu ,  Adam Norman ,  Min Suet Lim ,  Miaomiao Ma ,  Mackenzie Norman ,  John Vu ,  Ching Leong Ooi ,  Eng Same Tan ,  Luis Carlos Alvarez Mata

IPC分类号： G06F30/392 ,  G06F30/27

CPC分类号： G06F30/392 ,  G06F30/27

摘要： Systems, apparatuses and methods may provide for technology that receives parameter results and scores of one or more local sessions with respect to subcircuit components in a bounded area, aggregates the parameter results and scores, and generates a global placement model based on an output of the aggregated parameter results and scores.