公开(公告)号：US20240402445A1

公开(公告)日：2024-12-05

申请号：US18798574

申请日：2024-08-08

Applicant: Intel Corporation

Inventor： Bassam ZIADEH ,  Jingyi HUANG ,  Yiqun BAI ,  Ziyin LIN ,  Vipul MEHTA ,  Joseph VAN NAUSDLE

IPC: G02B6/42

Abstract: Embodiments described herein may be related to apparatuses, processes, and techniques related to hydrophobic features to block or slow the spread of epoxy. These hydrophobic features are placed either on a die surface or on a substrate surface to control epoxy spread between the die in the substrate to prevent formation of fillets. Packages with these hydrophobic features may include a substrate, a die with a first side and a second side opposite the first side, the second side of the die physically coupled with a surface of the substrate, and a hydrophobic feature coupled with the second side of the die or the surface of the substrate to reduce a flow of epoxy on the substrate or die. In embodiments, these hydrophobic features may include a chemical barrier or a laser ablated area on the substrate or die. Other embodiments may be described and/or claimed.

公开(公告)号：US20220310566A1

公开(公告)日：2022-09-29

申请号：US17214083

申请日：2021-03-26

Applicant: Intel Corporation

Inventor： Xiaoqian LI ,  Wei LI ,  Santosh SHAW ,  Jingyi HUANG

IPC: H01L25/075 ,  H01L33/62 ,  G02B6/42 ,  G02B6/12 ,  H01L33/58

Abstract: Embodiments disclosed herein include photonics packages. In an embodiment, a photonics package includes a photonics die and a plurality of v-grooves on the photonics die. A barrier structure proximate the plurality of v-grooves.

公开(公告)号：US20220196937A1

公开(公告)日：2022-06-23

申请号：US17132851

申请日：2020-12-23

Applicant: Intel Corporation

Inventor： Bassam ZIADEH ,  Jingyi HUANG ,  Yiqun BAI ,  Ziyin LIN ,  Vipul MEHTA ,  Joseph VAN NAUSDLE

IPC: G02B6/42

Abstract: Embodiments described herein may be related to apparatuses, processes, and techniques related to hydrophobic features to block or slow the spread of epoxy. These hydrophobic features are placed either on a die surface or on a substrate surface to control epoxy spread between the die in the substrate to prevent formation of fillets. Packages with these hydrophobic features may include a substrate, a die with a first side and a second side opposite the first side, the second side of the die physically coupled with a surface of the substrate, and a hydrophobic feature coupled with the second side of the die or the surface of the substrate to reduce a flow of epoxy on the substrate or die. In embodiments, these hydrophobic features may include a chemical barrier or a laser ablated area on the substrate or die. Other embodiments may be described and/or claimed.