公开(公告)号：US20220310566A1

公开(公告)日：2022-09-29

申请号：US17214083

申请日：2021-03-26

Applicant: Intel Corporation

Inventor： Xiaoqian LI ,  Wei LI ,  Santosh SHAW ,  Jingyi HUANG

IPC: H01L25/075 ,  H01L33/62 ,  G02B6/42 ,  G02B6/12 ,  H01L33/58

Abstract: Embodiments disclosed herein include photonics packages. In an embodiment, a photonics package includes a photonics die and a plurality of v-grooves on the photonics die. A barrier structure proximate the plurality of v-grooves.

公开(公告)号：US20230314735A1

公开(公告)日：2023-10-05

申请号：US17710725

申请日：2022-03-31

Applicant: Intel Corporation

Inventor： Santosh SHAW

IPC: G02B6/42 ,  H01L23/00

CPC classification number: G02B6/4243 ,  H01L2224/13026 ,  H01L24/03 ,  H01L24/05 ,  H01L24/11 ,  H01L24/13 ,  H01L2224/03462 ,  H01L2224/03614 ,  H01L2224/03622 ,  H01L2224/0401 ,  H01L2224/05027 ,  H01L2224/05166 ,  H01L2224/05147 ,  H01L2224/11462 ,  H01L2224/11849 ,  G02B6/4206

Abstract: Embodiments disclosed herein include electronic devices and methods of forming electronic devices. In an embodiment, an electronic device comprises a die. In an embodiment, the die comprises a semiconductor substrate, a bump field over the semiconductor substrate, and a V-groove into the semiconductor substrate, wherein the V-groove extends to an edge of the semiconductor substrate. In an embodiment, the V-groove is free from conductive material. In an embodiment, the electronic device further comprises an optical fiber inserted into the V-groove.