公开(公告)号：US20210035859A1

公开(公告)日：2021-02-04

申请号：US16526012

申请日：2019-07-30

申请人： Intel Corporation

发明人： Vipul MEHTA ,  Yiqun BAI ,  Ziyin LIN ,  John DECKER ,  Yan LI

IPC分类号： H01L21/768 ,  H01L21/56 ,  H01L23/31 ,  H01L23/367 ,  H01L23/373

摘要： Embodiments disclosed herein include composite dies and methods of forming such composite dies. In an embodiment, a composite die comprises a base substrate, a first die over the base substrate, and a second die over the base substrate and adjacent to the first die. In an embodiment an underfill layer is between the first die and the base substrate, between the second die and the base substrate, and between the first die and the second die. In an embodiment, a trench into the underfill layer is between the first die and the second die. In an embodiment the composite die further comprises, a mold layer over the first die and the second die, wherein the mold layer fills the trench.

公开(公告)号：US20240186279A1

公开(公告)日：2024-06-06

申请号：US18060577

申请日：2022-12-01

申请人： Intel Corporation

发明人： Minglu LIU ,  Yosuke KANAOKA ,  Jung Kyu HAN ,  Gang DUAN ,  Ziyin LIN

IPC分类号： H01L23/00 ,  B32B37/12

CPC分类号： H01L24/75 ,  B32B37/12 ,  H01L24/29 ,  H01L24/32 ,  H01L24/83 ,  H01L2224/2919 ,  H01L2224/29191 ,  H01L2224/32225 ,  H01L2224/75251 ,  H01L2224/75252 ,  H01L2224/7531 ,  H01L2224/83191 ,  H01L2224/83193 ,  H01L2224/83874 ,  H01L2924/0635 ,  H01L2924/0665 ,  H01L2924/069 ,  H01L2924/0715

摘要： The present disclosure relates to a system. The system may include a stage configured to support a substrate. The system may also include a bondhead configured to press a device against the substrate. The system may further include a light source configured to emit UV light towards the stage.

公开(公告)号：US20190304808A1

公开(公告)日：2019-10-03

申请号：US15942109

申请日：2018-03-30

申请人： Intel Corporation

发明人： Ziyin LIN ,  Vipul MEHTA ,  Edvin CETEGEN ,  Yuying WEI ,  Sushrutha GUJJULA ,  Nisha ANANTHAKRISHNAN ,  Shan ZHONG

IPC分类号： H01L21/56 ,  H01L21/67 ,  H01L23/13 ,  H01L23/31 ,  H01L23/00

摘要： A substrate protrusion is described. The substrate protrusion includes a top portion that extends in a first direction toward a gap between the first die and the second die and in a second direction parallel to the gap between the first die and the second die. The substrate protrusion also includes a base portion that is coupled to a substrate that extends underneath the first die and the second die.

公开(公告)号：US20220165585A1

公开(公告)日：2022-05-26

申请号：US17669288

申请日：2022-02-10

申请人： Intel Corporation

发明人： Ziyin LIN ,  Vipul MEHTA ,  Edvin CETEGEN ,  Yuying WEI ,  Sushrutha GUJJULA ,  Nisha ANANTHAKRISHNAN ,  Shan ZHONG

IPC分类号： H01L21/56 ,  H01L21/67 ,  H01L23/00 ,  H01L23/31 ,  H01L23/13

摘要： A substrate protrusion is described. The substrate protrusion includes a top portion that extends in a first direction toward a gap between the first die and the second die and in a second direction parallel to the gap between the first die and the second die. The substrate protrusion also includes a base portion that is coupled to a substrate that extends underneath the first die and the second die.

公开(公告)号：US20210066152A1

公开(公告)日：2021-03-04

申请号：US16557891

申请日：2019-08-30

申请人： Intel Corporation

发明人： Ziyin LIN ,  Elizabeth NOFEN ,  Vipul MEHTA ,  Taylor GAINES

IPC分类号： H01L23/31 ,  H01L21/56 ,  H01L21/67 ,  H01L23/373 ,  H01L23/367

摘要： A device is disclosed. The device includes a first die, a plurality of chiplets above the first die, a first underfill material beneath the chiplets, and a gap fill material between the chiplets. The gap fill material is different from the first underfill material. An interface region is formed between the first underfill material and the gap fill material

公开(公告)号：US20240332125A1

公开(公告)日：2024-10-03

申请号：US18128848

申请日：2023-03-30

申请人： Intel Corporation

发明人： Kyle ARRINGTON ,  Clay ARRINGTON ,  Bohan SHAN ,  Haobo CHEN ,  Srinivas V. PIETAMBARAM ,  Gang DUAN ,  Ziyin LIN ,  Hongxia FENG ,  Yiqun BAI ,  Xiaoying GUO ,  Dingying XU ,  Bai NIE

IPC分类号： H01L23/373 ,  H01L21/48 ,  H01L23/24 ,  H01L23/498

CPC分类号： H01L23/3737 ,  H01L21/4857 ,  H01L21/486 ,  H01L23/24 ,  H01L23/49822 ,  H01L23/49827

摘要： Embodiments disclosed herein include a package substrate. In an embodiment, the package substrate comprises a first layer and a second layer over the first layer. In an embodiment, the second layer comprises a dielectric material including sulfur. In an embodiment, fillers are within the second layer. In an embodiment, the fillers have a volume fraction that is less than approximately 0.2.

公开(公告)号：US20240153837A1

公开(公告)日：2024-05-09

申请号：US17983226

申请日：2022-11-08

申请人： Intel Corporation

发明人： Ziyin LIN ,  Vipul MEHTA ,  Jonas CROISSANT ,  Jigneshkumar PATEL ,  Dingying XU ,  Gang DUAN ,  Aditya Sumanth YERRAMILLI ,  Suriyakala RAMALINGAM ,  Xavier BRUN

IPC分类号： H01L23/31 ,  H01L23/498 ,  H01L25/18

CPC分类号： H01L23/3157 ,  H01L23/49811 ,  H01L25/18 ,  H01L24/32 ,  H01L2224/32225

摘要： Embodiments disclosed herein include electronic packages. In an embodiment, the electronic package comprises a die, and an array of pillars adjacent to the die. In an embodiment, the electronic package further comprises an underfill under the die, where an edge of the underfill is between an inner column of pillars in the array of pillars and an outer edge of the die, and where the edge of the underfill has a height that is less than a maximum height of the underfill.

公开(公告)号：US20200005983A1

公开(公告)日：2020-01-02

申请号：US16024718

申请日：2018-06-29

申请人： Intel Corporation

发明人： Malavarayan SANKARASUBRAMANIAN ,  Yongki MIN ,  Anne AUGUSTINE ,  Kaladhar RADHAKRISHNAN ,  Taylor GAINES ,  Ziyin LIN

IPC分类号： H01F27/02 ,  H01F1/42 ,  H01F41/00 ,  H01F1/01 ,  H01L25/16 ,  H01L21/48 ,  H01F27/29

摘要： Embodiments herein relate to a magnetic encapsulant composite, comprising a mixture of a first material that is a soft magnetic filler, a second material that is a polymer matrix, and a third material that is a process ingredient. The magnetic encapsulant composite may then encapsulate or partially encapsulate a magnetic inductor coupled to a substrate to increase the inductance of the magnetic inductor and/or to strengthen the substrate to which the magnetic inductor and the composite are coupled.

公开(公告)号：US20240363520A1

公开(公告)日：2024-10-31

申请号：US18139083

申请日：2023-04-25

申请人： Intel Corporation

发明人： Ziyin LIN ,  Boer LIU ,  Dingying David XU ,  Karumbu MEYYAPPAN

IPC分类号： H01L23/498 ,  H01R12/52

CPC分类号： H01L23/49894 ,  H01L23/49811 ,  H01L23/49833 ,  H01R12/52 ,  H01L24/16 ,  H01L24/32 ,  H01L24/73 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01R4/2406 ,  H01R12/58 ,  H05K1/181 ,  H05K2201/10189 ,  H05K2201/10378

摘要： Embodiments disclosed herein include a package substrate. In an embodiment, the package substrate comprises a substrate with a layer on the substrate. In an embodiment, the layer comprises a plurality of wells. In an embodiment, a liquid metal is in the plurality of wells. In an embodiment, a cap is on the layer to seal the plurality of wells, where the cap comprises a polymer, and fibers within the polymer.

公开(公告)号：US20240213164A1

公开(公告)日：2024-06-27

申请号：US18089483

申请日：2022-12-27

申请人： Intel Corporation

发明人： Minglu LIU ,  Gang DUAN ,  Liang HE ,  Ziyin LIN ,  Elizabeth NOFEN ,  Yiqun BAI ,  Jonathan ATKINS ,  Jesus S. NIETO PESCADOR ,  Srinivas V. PIETAMBARAM ,  Kristof DARMAWIKARTA

IPC分类号： H01L23/538 ,  H01L23/00 ,  H01L23/522 ,  H01L23/528

CPC分类号： H01L23/5381 ,  H01L23/5226 ,  H01L23/5283 ,  H01L24/14 ,  H01L2224/16104

摘要： Embodiments disclosed herein include an electronic package. In an embodiment, the electronic package comprises a package substrate, and an opening in the package substrate. In an embodiment, a plurality of first pads are provided at a bottom of the opening, and a bridge die is in the opening. In an embodiment, the bridge die comprises a plurality of second pads that are coupled to the first pads by solder. In an embodiment, a non-conductive film (NCF) is around the solder between the first pads and the second pads.