公开(公告)号：US20240134432A1

公开(公告)日：2024-04-25

申请号：US18537697

申请日：2023-12-12

Applicant: Intel Corporation

Inventor： Akhilesh S. THYAGATURU ,  Francesc GUIM BERNAT ,  Karthik KUMAR ,  Jonathan KYLE ,  Marek PIOTROWSKI

IPC: G06F1/20 ,  G06F9/455

CPC classification number: G06F1/206 ,  G06F9/45558 ,  G06F2009/45591

Abstract: A method is claimed. The method includes receiving information associated with a software application's workflow. The method includes receiving information that describes a platform's current power consumption state and current thermal state. The method includes selecting platform components to support execution of the workflow. The method includes prior to execution of the workflow upon the selected platform components, estimating a thermal impact to the platform's current thermal state as a consequence of the workflow's execution upon the selected platform components. The method includes determining a change to be made to a thermal cooling system of the platform in response to the estimating and causing the change to be made to the thermal cooling system prior to execution of at least a portion of the workflow on the platform.