公开(公告)号：US20220392842A1

公开(公告)日：2022-12-08

申请号：US17888177

申请日：2022-08-15

Applicant: Intel Corporation

Inventor： Robert Alan MAY ,  Wei-Lun Kane JEN ,  Jonathan L. ROSCH ,  Islam A. SALAMA ,  Kristof DARMAWIKARTA

IPC: H01L23/538 ,  H01L21/48 ,  H01L21/683 ,  H01L23/00 ,  H01L25/065 ,  H01L25/00

Abstract: A device and method for providing enhanced bridge structures is disclosed. A set of conducting and insulating layers are deposited and lithographically processed. The conducting layers have uFLS routing. A bridge with uFLS contacts and die disposed on the underlying structure such that the die are connected with the uFLS contacts and uFLS routing. For core-based structures, the layers are formed after the bridge is placed on the underlying structure and the die connected to the bridge through intervening conductive layers. For coreless structures, the layers are formed over the bridge and carrier, which is removed prior to bonding the die to the bridge, and the die bonded directly to the bridge.

公开(公告)号：US20240258240A1

公开(公告)日：2024-08-01

申请号：US18629424

申请日：2024-04-08

Applicant: Intel Corporation

Inventor： Robert Alan MAY ,  Wei-Lun Kane JEN ,  Jonathan L. ROSCH ,  Islam A. SALAMA ,  Kristof DARMAWIKARTA

IPC: H01L23/538 ,  H01L21/48 ,  H01L21/683 ,  H01L23/00 ,  H01L25/00 ,  H01L25/065

CPC classification number: H01L23/5381 ,  H01L21/4853 ,  H01L21/4857 ,  H01L21/486 ,  H01L21/6835 ,  H01L23/5383 ,  H01L23/5384 ,  H01L23/5386 ,  H01L24/16 ,  H01L25/0655 ,  H01L25/50 ,  H01L2221/68372 ,  H01L2224/16227

Abstract: A device and method for providing enhanced bridge structures is disclosed. A set of conducting and insulating layers are deposited and lithographically processed. The conducting layers have uFLS routing. A bridge with uFLS contacts and die disposed on the underlying structure such that the die are connected with the uFLS contacts and uFLS routing. For core-based structures, the layers are formed after the bridge is placed on the underlying structure and the die connected to the bridge through intervening conductive layers. For coreless structures, the layers are formed over the bridge and carrier, which is removed prior to bonding the die to the bridge, and the die bonded directly to the bridge.

公开(公告)号：US20230135165A1

公开(公告)日：2023-05-04

申请号：US18091048

申请日：2022-12-29

Applicant: Intel Corporation

Inventor： Robert Alan MAY ,  Wei-Lun Kane JEN ,  Jonathan L. ROSCH ,  Islam A. SALAMA ,  Kristof DARMAWIKARTA

IPC: H01L23/538 ,  H01L21/48 ,  H01L21/683 ,  H01L23/00 ,  H01L25/065 ,  H01L25/00

Abstract: A device and method for providing enhanced bridge structures is disclosed. A set of conducting and insulating layers are deposited and lithographically processed. The conducting layers have uFLS routing. A bridge with uFLS contacts and die disposed on the underlying structure such that the die are connected with the uFLS contacts and uFLS routing. For core-based structures, the layers are formed after the bridge is placed on the underlying structure and the die connected to the bridge through intervening conductive layers. For coreless structures, the layers are formed over the bridge and carrier, which is removed prior to bonding the die to the bridge, and the die bonded directly to the bridge.