公开(公告)号：US20220336322A1

公开(公告)日：2022-10-20

申请号：US17850676

申请日：2022-06-27

Applicant: Intel Corporation

Inventor： Juha T. Paavola ,  Rob W. Sims ,  Alonso J. Rodriguez Chacon ,  Emery E. Frey ,  Monica Maria Conejo Herrera ,  Jerrod P. Peterson ,  Jose R. Diaz ,  Jose Guillermo Salazar Delgado

IPC: H01L23/40 ,  H01L23/46 ,  H05K7/20 ,  G06F1/20

Abstract: Techniques for package loading mechanisms are disclosed. In the illustrative embodiment, a base portion of a laptop includes a circuit board on which an integrated circuit component is mounted. A heat sink is mated with the integrated circuit component. A spring presses against part of the chassis of the laptop, pressing the integrated circuit component and the heat sink together, providing strong thermal coupling between them.