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    POWER SUPPLY COMMUNICATIONS VIA A SHARED CHANNEL FOR PERFORMANCE MANAGEMENT
    1.
    发明公开
    POWER SUPPLY COMMUNICATIONS VIA A SHARED CHANNEL FOR PERFORMANCE MANAGEMENT 审中-公开

    公开(公告)号：US20230315658A1

    公开(公告)日：2023-10-05

    申请号：US17711380

    申请日：2022-04-01

    Applicant: Intel Corporation

    Inventor： Rob W. Sims ,  Aurelio Rodriguez Echevarria ,  Jorge P. Rodriguez ,  Phil R. Lehwalder ,  Sivasankarareddy Juturu ,  Stephen P. Eastman

    IPC: G06F13/20

    CPC classification number: G06F13/20 ,  G06F2213/40

    Abstract: A power supply comprising a hardware interface having conductive contacts and conforming to a power supply design standard comprising a pin-out definition specifying that a first conductive contact is to be dedicated to communicating first information of a first type. The power supply comprises first, second, and third circuitry. The first circuitry is to determine the first information. The second circuitry is to determine second information of a second type, wherein the second type of information is other than the first type. The third circuitry is to send, via the first conductive contact, a communication comprising the first information and the second information. In embodiments, a PCB comprises a connector to couple the PCB to the power supply via an interconnect to be coupled to the hardware interface, and an IC to receive the communication, and identify the first and second information.

    SYSTEM AND METHOD TO HELP MITIGATE HEAT IN AN ELECTRONIC DEVICE
    3.
    发明申请
    SYSTEM AND METHOD TO HELP MITIGATE HEAT IN AN ELECTRONIC DEVICE 有权

    公开(公告)号：US20210112679A1

    公开(公告)日：2021-04-15

    申请号：US17130689

    申请日：2020-12-22

    Applicant: Intel Corporation

    Inventor： Baomin Liu ,  Rob W. Sims ,  Kannan G. Raja ,  Linden H. McClure ,  Gopinath Kandasamy

    IPC: H05K7/20

    Abstract: Particular embodiments described herein provide for an electronic device that can be configured to include a substrate, a plurality of heat sources on the substrate, a heat spreader that extends over the plurality of heat sources, and a plurality of heat spreader mounting brackets. Each of the plurality of heat spreader mounting brackets are over a corresponding heat source from the plurality of heat sources and the plurality of heat spreaders secure the heat spreader to the substrate without extending through the heat spreader. In some examples, the heat spreader is a vapor chamber and the plurality of heat spreader mounting brackets are soldered to the vapor chamber.

    System and method to help mitigate heat in an electronic device
    4.
    发明授权
    System and method to help mitigate heat in an electronic device 有权

    公开(公告)号：US12150280B2

    公开(公告)日：2024-11-19

    申请号：US17130689

    申请日：2020-12-22

    Applicant: Intel Corporation

    Inventor： Baomin Liu ,  Rob W. Sims ,  Kannan G. Raja ,  Linden H. McClure ,  Gopinath Kandasamy

    IPC: H05K7/20 ,  G06F1/20

    Abstract: Particular embodiments described herein provide for an electronic device that can be configured to include a substrate, a plurality of heat sources on the substrate, a heat spreader that extends over the plurality of heat sources, and a plurality of heat spreader mounting brackets. Each of the plurality of heat spreader mounting brackets are over a corresponding heat source from the plurality of heat sources and the plurality of heat spreaders secure the heat spreader to the substrate without extending through the heat spreader. In some examples, the heat spreader is a vapor chamber and the plurality of heat spreader mounting brackets are soldered to the vapor chamber.

    Power supply communications via a shared channel for performance management
    6.
    发明授权
    Power supply communications via a shared channel for performance management 有权

    公开(公告)号：US12093196B2

    公开(公告)日：2024-09-17

    申请号：US17711380

    申请日：2022-04-01

    Applicant: Intel Corporation

    Inventor： Rob W. Sims ,  Aurelio Rodriguez Echevarria ,  Jorge P. Rodriguez ,  Phil R. Lehwalder ,  Sivasankarareddy Juturu ,  Stephen P. Eastman

    IPC: G06F13/20 ,  G06F1/26 ,  G06F1/28

    CPC classification number: G06F13/20 ,  G06F2213/40

    Abstract: A power supply comprising a hardware interface having conductive contacts and conforming to a power supply design standard comprising a pin-out definition specifying that a first conductive contact is to be dedicated to communicating first information of a first type. The power supply comprises first, second, and third circuitry. The first circuitry is to determine the first information. The second circuitry is to determine second information of a second type, wherein the second type of information is other than the first type. The third circuitry is to send, via the first conductive contact, a communication comprising the first information and the second information. In embodiments, a PCB comprises a connector to couple the PCB to the power supply via an interconnect to be coupled to the hardware interface, and an IC to receive the communication, and identify the first and second information.

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