公开(公告)号：US12170319B2

公开(公告)日：2024-12-17

申请号：US17033362

申请日：2020-09-25

Applicant: Intel Corporation

Inventor： Kevin Cook ,  Anand S. Murthy ,  Gilbert Dewey ,  Nazila Haratipour ,  Ralph Thomas Troeger ,  Christopher J. Jezewski ,  I-Cheng Tung

IPC: H01L29/417 ,  H01L21/8238 ,  H01L27/092 ,  H01L29/40 ,  H01L29/45 ,  H01L29/66 ,  H01L29/78

Abstract: Embodiments disclosed herein include complementary metal-oxide-semiconductor (CMOS) devices and methods of forming CMOS devices. In an embodiment, a CMOS device comprises a first transistor with a first conductivity type, where the first transistor comprises a first source region and a first drain region, and a first metal over the first source region and the first drain region. In an embodiment, the CMOS device further comprises a second transistor with a second conductivity type opposite form the first conductivity type, where the second transistor comprises a second source region and a second drain region, a second metal over the second source region and the second drain region, and the first metal over the second metal.