公开(公告)号：US10950536B2

公开(公告)日：2021-03-16

申请号：US16017710

申请日：2018-06-25

Applicant: Intel Corporation

Inventor： Zhen Zhou ,  Jun Liao ,  Xiang Li ,  Kevin Stone ,  Daqiao Du ,  Tae-Young Yang ,  Ling Zheng ,  James A. McCall

IPC: H01L23/498 ,  H01R12/71 ,  H01R43/20 ,  H01R43/16 ,  H01R12/57 ,  H01R12/52 ,  H01R13/6467 ,  H01R12/70

Abstract: An apparatus is described. The apparatus includes an electro-mechanical interface having angled signal interconnects, wherein, the angling of the signal interconnects is to reduce noise coupling between the angled signal interconnects.